印 制 电 路 板 （Printed Circuit Boards） | |
IPC-M-105 | |
IPC-D-325A | Documentation Requirements for Printed Boards 印制板设计文件图册要求 |
IPC-PE-740A | Troubleshooting for Printed Board Manufacture and Assembly 印制板制造和组装的故障排除 |
IPC-MB-380 | Guidelines for Molded Interconnection Devices 模压互连器件导则 |
IPC-D-326A | Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies 印制板制造和其它电子组装的信息要求规范 |
IPC-6010 Series | |
IPC-6011 | Generic Performance Specification for Printed Boards 印制板通用性能规范 |
IPC-6012B | Qualification and Performance Specification for Rigid Printed Boards 刚性板的合格和性能规范要求 |
IPC-6015 | Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 |
IPC-6016 | Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范 |
IPC-6018A | Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试 |
IPC-A-600G | Acceptability of Printed Boards 印制板验收条件 |
IPC-QE-605A | Printed Board Quality Evaluation Handbook 印制板质量评价 |
IPC-PWB-EVAL-CH | Printed Circuit Board Defect Evaluation Chart 印制板缺陷评估图表 |
IPC-HM-860 | Specification for Multilayer Hybrid Circuits 多层混合电路规范 |
IPC-TF-870 | Qualification and Performance of Polymer Thick Film Printed Boards 聚合物厚膜印制板的鉴定与性能 |
IPC-ML-960 | Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范 |
IPC-TR-481 | |
IPC-TR-551 | Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于电子元件安装与互连的印制板质量评价 |
IPC-TR-579 | Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直径镀覆孔可靠性评价联合试验 |
IPC-4552 | Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍/沉金规范 |
IPC-DR-572 | Drilling Guidelines for Printed Boards 印制板钻孔导则 |
IT-95080 | |
IPC-NC-349 | Computer Numerical Control Formatting for Drillers and Routers 钻床和铣床用计算机数字控制格式 |
IPC-SM-839 | Pre & Post Solder Mask Application Cleaning Guidelines 施加阻焊前及施加后清洗导则 |
IPC-HDI-1 | High Density Interconnect Microvia Technology Compendium 高密度(HDI)互连微通孔技术纲要 |
IPC/JPCA-4104 | Specification for High Density Interconnect (HDI) and Microvia Materials 高密度互连(HDI)及微导通孔材料规范 |
IPC-6016 | Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范 |
IPC/JPCA-6801 | IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection 积层/高密度互连的术语和定义、试验方法与设计例 |
IPC-DD-135 | Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验 |
IT-96060 | High Density PCB Microvia Evaluation (October Project), Phase I, Round 1 高密度印制板微通孔评价指标手册, 第一期第一版 |
IT-97071 | High Density PCB Microvia Evaluation, Phase I, Round 2 高密度印制板微通孔评价指标手册, 第一期第二版 |
IT-30101 | High Density PCB Microvia Evaluation, Phase I, Round 3 高密度印制板微通孔评价指标手册, 第一期第三版 |
IT-98123 | Microvia Manufacturing Technology Cost Analysis Report 微通孔制作技术成本核算报告 |
IPC-2141A | Controlled Impedance Circuit Boards & High Speed Logic Design 控制阻抗电路板与高速逻辑设计 |
IPC-2251 | Design Guide for the Packaging of High Speed Electronic Circuits 高速电子电路封装的设计指南 |
IPC-2252 | Design Guide for RF/Microwave Circuit Boards 射频/微波电路板设计指南 |
IPC-4103 | Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范 |
IPC-6018A | Microwave End Product Board Inspection and Test 微波成品印制板的检验和测试 |
IPC-D-317A | Design Guidelines for Electronic Packaging Utilizing High Speed Techniques 采用高速技术电子封装设计导则 |
IPC-M-102 | Flexible Circuits Compendium 挠性电路纲要 |
IPC-4202 | Flexible Base Dielectrics for Use in Flexible Printed Circuitry 挠性印制线路用挠性绝缘基底材料 |
IPC-4203 | Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films 挠性印制线路覆盖层用涂粘接剂绝缘薄膜 |
IPC-4204 | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 挠性金属箔去电应用于柔性电路组装 |
IPC-6013A | Qualification & Performance Specification for Flexible Printed Boards 挠性印制板的鉴定与性能规范 |
IPC/JPCA-6202 | IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA单双面挠性印制板性能手册 |
IPC-FA-251 | Guidelines for Assembly of Single- and Double-Sided Flex Circuits 单面和双面挠性电路组装导则 |
IPC-FC-234 | Composite Metallic Materials Specification for Printed Wiring Boards 印制线路板复合金属材料规范 |
IPC-M-107 | Standards for Printed Board Materials Manual 印制板材料标准手册 |
IPC-MI-660 | Incoming Inspection of Raw Materials Manual 原材料接收检验手册 |
IPC-4101A | Specifications for Base Materials for Rigid and Multilayer Printed Boards 刚性及多层印制板用基材规范 |
IPC-4121 | Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则 |
IPC-4562 | Metal Foil for Printed Wiring Applications 印制线路用金属箔 |
IPC-CF-148A | Resin Coated Metal for Printed Boards 印制板用涂树脂金属箔 |
IPC-CF-152B | Composite Metallic Materials Specification for Printed Wiring Boards 印制线路板复合金属材料规范 |
IPC-TR-482 | New Developments in Thin Copper Foils 薄铜箔的新发展 |
IPC-TR-484 | Results of IPC Copper Foil Ductility Round Robin Study IPC铜箔延展性联合研究结果 |
IPC-TR-485 | Results of Copper Foil Rupture Strength Test Round Robin Study 铜箔断裂强度试验联合研究结果 |
IPC-4412 | Specification for Finished Fabric Woven from ”E” Glass for Printed Boards “E”类精纺玻璃纤维层印制板技术规范 |
IPC-4130 | Specification & Characterization Methods for Nonwoven "E" Glass Materials E 玻璃纤维非织布材料规范及性能确定方法 |
IPC-4110 | Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards 印制板用纤维纸规范及性能确定方法 |
IPC-4411-A | Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement 聚芳基酰胺非织布规范及性能确定方法 |
IPC-SG-141 | Specification for Finished Fabric Woven from "S" Glass for Printed Boards 印制板用经处理S玻璃纤维织物规范 |
IPC-A-142 | Specification for Finished Fabric Woven from Aramid for Printed Boards 印制板用经处理聚芳酰胺纤维编织物规范 |
IPC-QF-143 | Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范 |
IPC-2524 | PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系 |
IPC-9151A | Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database 印制板工艺, 容量, 质量,可靠性试验标准和数据库 |
IPC-9191 | General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计过程控制(SPC)的通用导则 |
IPC-9199 | Statistical Process Control (SPC) Quality Rating 统计分析控制 |
IPC-9252 | Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南 |
IT-97061 | PWB Hole to Land Misregistration: Causes and Reliability 印制线路板通孔与焊盘的错位: 原因和可靠性 |
IT-98103 | Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性 |
IPC-MS-810 | Guidelines for High Volume Microsection 大批量显微剖切导则 |
IPC-QL-653A | Certification of Facilities that Inspect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证 |
IPC-TR-483 | Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test 薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告 |
IPC-TR-486 | Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 内层分离的互连应力测试(IST)与显微剖切相关性联合研究 |
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