IPC-M-105 Rigid Printed Board Manual
IPC-D-325A Documentation Requirements for Printed Boards
印制板设计文件图册要求IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly
印制板制造和组装的故障排除
IPC-6010 Series IPC-6010 Qualification and Performance Series
IPC-6010印制电路板质量标准和性能规范系列手册
IPC-6011 Generic Performance Specification for Printed Boards
印制板通用性能规范
IPC-6013A Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1)
IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
高密度互连(HDI)层或印制板的鉴定与性能规范 IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
刚性印制板的鉴定与性能规范 (包括修改单1)
IPC-6018A Microwave End Product Board Inspection and Tech
微波成品印制板的检验和测试
IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections
有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范
IPC-A-600F Acceptability of Printed Boards
印制板验收条件
IPC-QE-605A Printed Board Quality Evaluation Handbook
印制板质量评价
IPC-QE-605A-KIT Hard Copy and CD
印制板质量评价书和光盘(CD)
IPC-HM-860 Specification for Multilayer Hybrid Circuits
多层混合电路规范
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards
聚合物厚膜印制板的鉴定与性能
IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范
IPC-TR-481 Results of Multilayer Tests Program Round Robin
多层印制板联合试验计划结果
IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnectin
g Electronic Components
用于电子元件安装与互连的印制板质量评价
IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs
印制板中小直径镀覆孔可靠性评价联合试验
IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards
印制电路板表面非电镀镍/沉金规范
IPC-DR-572 Drilling Guidelines for Printed Boards
印制板钻孔导则
IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias
IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers
钻床和铣床用计算机数字控制格式
IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines
施加阻焊前及施加后清洗导则
IPC-HDI-1 High Density Interconnect Microvia Technology Compendium
高密度(HDI)互连微通孔技术纲要
IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials
高密度互连(HDI)及微导通孔材料规范
IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
高密度互连(HDI)层或印制板的鉴定与性能规范
IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection
积层/高密度互连的术语和定义、试验方法与设计例
IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
多芯片组件内层有机绝缘材料的鉴定试验
IT-96060 High Density PCB Microvia Evaluation (October Project), Phase I, Round 1
高密度印制板微通孔评价指标手册, 第一期第一版
IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2
高密度印制板微通孔评价指标手册, 第一期第二版
IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3
高密度印制板微通孔评价指标手册, 第一期第三版
IT-98123 Microvia Manufacturing Technology Cost Analysis Report
微通孔制作技术成本核算报告
IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design
控制阻抗电路板与高速逻辑设计
IPC-2252 Design Guide for RF/Microwave Circuit Boards
射频/微波电路板设计指南
IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications
高速高频用基材规范
IPC-6018A Microwave End Product Board Inspection and Test
微波成品印制板的检验和测试
IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High Speed Techniques
采用高速技术电子封装设计导则
IPC-M-102 Flexible Circuits Compendium
挠性电路纲要
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry
挠性印制线路用挠性绝缘基底材料
IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
挠性印制线路覆盖层用涂粘接剂绝缘薄膜
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitr
y
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