专利名称：Systems and methods for post-bonding wafer edge seal
发明人：Yi-Chuan Teng,Jung-Huei Peng,Shang-Ying
档案2013
Tsai,Hsin-Ting Huang,Lin-Min Hung,Yao-Te
苏皖Huang,Chin-Yi Cho诗人的别称
申请号：US13771382
网上杂志申请日：20130220
公开号：US08841201B2
公开日：
延吉市十二中
20140923
专利附图：
摘要：A method for fabricating a semiconductor device is disclosed. A first substrate is
arranged over a second substrate. A wafer bonding process is performed on the semiconductor device. First regions of the device are enclosed by the bonding process. Second regions of the device remain exposed. One or more processes are performed on the exposed second regions, after performing the wafer bonding process. The one or more processes include a fill process that forms a fill material within the exposed second regions. An edge seal material is applied on the first and second substrates after performing the one or more processes.
申请人：Taiwan Semiconductor Manufacturing Co., Ltd.
地址：Hsin-Chu TW
国籍：TW
代理机构：Eschweiler & Associates, LLC
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