PCI Express®
Mini Card Electromechanical
Specification
Revision 1.21
March 28October 26, 20075
Revision Revision
History Date
release. 6/02/03
美洲虎xk81.0 Initial
1.1 Incorporated approved Errata and ECNs. 3/28/05
1.2 Incorporated approved ECNs. 10/26/2007
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Contact the PCI-SIG office to obtain the latest revision of the specification.
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DISCLAIMER
This PCI Express Mini Card Electromechanical Specification is provided "as is" with no
warranties whatsoever, including any warranty of merchantability, noninfringement, fitness
for any particular purpose, or any warranty otherwise arising out of any proposal,
specification, or sample. PCI-SIG disclaims all liability for infringement of proprietary
rights, relating to use of information in this specification. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted herein.
PCI, PCI Express, PCIe, and PCI-SIG are trademarks or registered trademarks of PCI-SIG.
All other product names are trademarks, registered trademarks, or service marks of their respective owners.
Copyright © 2003, 2005,-05 2007 PCI-SIG
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Contents
1. INTRODUCTION (7)
1.1. O VERVIEW (7)
1.2. S PECIFICATION R EFERENCES (9)
1.3. T ARGETED A PPLICATIONS (9)
1.4. F EATURES AND B ENEFITS (10)
2. MECHANICAL SPECIFICATION (11)
2.1. O VERVIEW (11)
2.2. C ARD S PECIFICATIONS (11)
2.2.1.Card Form Factor (12)
2.2.2.Card and Socket Types (13)
2.2.3.Card PCB Details (14)
预设与生成
2.3. S YSTEM C ONNECTOR S PECIFICATIONS (23)
2.3.1.System Connector (23)
2.3.2.System Connector Parametric Specifications (27)
C ONNECTOR A REA (28)
2.4. I/O
2.5. R ECOMMENDED S OCKET C ONFIGURATIONS (29)
2.5.1.Single Use Full-Mini and Half-Mini Sockets (29)
2.5.2.Dual-Use Sockets (32)
2.5.3.Dual Head-to-Head Sockets (35)
2.5.4.Side-by-Side Socket Spacing (37)
2.6. T HERMAL G UIDELINES (38)
2.6.1.Thermal Design Definitions (38)
2.6.2.Thermal Guidelines for PCI Express Mini Card Add-in Card Designers (39)江西
食品网 2.6.2.1. Implementation Considerations (40)
2.6.
3.Thermal Guidelines for Integrating Wireless Wide Area Network Mini Card Add-in
Cards (41)
3. ELECTRICAL SPECIFICATIONS (45)
3.1. O VERVIEW (45)
3.2. S YSTEM I NTERFACE S IGNALS (45)
3.2.1.Power Sources and Grounds (47)
3.2.2.PCI Express Interface (47)
3.2.3.USB Interface (48)
3.2.4.Auxiliary Signals (48)
3.2.4.1. Reference Clock (48)
3.2.4.2. CLKREQ# Signal (48)
3.2.4.3. PERST# Signal (52)
3.2.4.4. WAKE# Signal (52)
3.2.4.5. SMBus (52)
3.2.5.Communications Specific Signals (53)
3.2.5.1. Status Indicators (53)
3.2.5.2. W_DISABLE# Signal (54)
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3.2.6.User Identity Module (UIM) Interface (55)
3.2.6.1. UIM_PWR (55)
3.2.6.2. UIM_RESET (56)
3.2.6.3. UIM_CLK (56)
3.2.6.4. UIM_VPP (56)
3.2.6.5. UIM_DATA (56)
3.3. C ONNECTOR P IN-OUT D EFINITIONS (57)
3.3.1.Grounds (58)
3.3.2.Coexistence Pins (58)
3.3.3.Reserved Pins (58)
3.4. E LECTRICAL R EQUIREMENTS (58)
3.4.1.Logic Signal Requirements (58)
3.4.2.Digital Interfaces (59)
3.4.3.Power (62)
3.5. C ARD E NUMERATION (62)
A. SUPPLEMENTAL GUIDELINES FOR PCI EXPRESS MINI CARD CONNECTOR
TESTING (63)
A.1. T EST B OARDS A SSEMBLY (63)
A.1.1.Base Board Assembly (64)
A.1.2.Plug-in Cards Assembly (65)
A.2. I NSERTION L OSS M EASUREMENT (66)
A.3. R ETURN L OSS M EASUREMENT (66)
A.4. N EAR E ND C ROSSTALK M EASUREMENT (66)
B. I/O CONNECTOR GUIDELINES (69)
B.1. W IRE-LINE M ODEMS (69)
B.2. IEEE 802.3 W IRED E THERNET (69)
W IRELESS E THERNET (69)
B.3. IEEE
802.11
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Figures
F IGURE 1-1: PCI E XPRESS M INI C ARD A DD-IN C ARD I NSTALLED IN A M OBILE P LATFORM (8)
F IGURE 1-2: L OGICAL R EPRESENTATION OF THE PCI E XPRESS M INI C ARD S PECIFICATION (8)
F IGURE 2-1: F ULL-M INI C ARD F ORM F ACTOR (M ODEM E XAMPLE A PPLICATION S HOWN) (12)
F IGURE 2-2: H ALF-M INI C ARD F ORM F ACTOR (W IRELESS E XAMPLE A PPLICATION S HOWN) (13)
F IGURE 2-3: F ULL-M INI C ARD T OP AND B OTTOM (15)
F IGURE 2-4: H ALF-M INI C ARD T OP AND B OTTOM (16)
F IGURE 2-5: C ARD T OP AND B OTTOM D ETAILS A AND B (17)
F IGURE 2-6: C ARD E DGE (19)
F IGURE 2-7: C ARD C OMPONENT K EEP O UT A REAS FOR F ULL-M INI C ARDS (21)
F IGURE 2-8: C ARD C OMPONENT K EEP O UT A REAS FOR H ALF-M INI C ARDS (22)
F IGURE 2-9: PCI E XPRESS M INI C ARD S YSTEM C ONNECTOR (23)
F IGURE 2-13: I/O C ONNECTOR L OCATION A REAS (29)
F IGURE 2-14: R ECOMMENDED S YSTEM B OARD L AYOUT FOR F ULL-M INI-O NLY S OCKET (30)
F IGURE 2-15: R ECOMMENDED S YSTEM B OARD L AYOUT FOR H ALF-M INI-O NLY S OCKET (31)
F IGURE 2-16: R ECOMMENDED S YSTEM B OARD L AYOUT (D ETAIL D) (32)
F IGURE 2-17: D UAL-U SE S OCKET (33)
F IGURE 2-18: R ECOMMENDED S YSTEM B OARD L AYOUT FOR D UAL-U SE S OCKET (34)
F IGURE 2-19: D UAL H EAD-TO-H EAD S OCKET (36)
F IGURE 2-20: R ECOMMENDED S YSTEM B OARD L AYOUT FOR D UAL H EAD-TO-H EAD S OCKETS (37)
鞋匠的儿子教学设计
F IGURE 2-21: R ECOMMENDED S YSTEM B OARD L AYOUT (S IDE-BY-S IDE S PACING) (38)
F IGURE 2-22: P OWER D ENSITY U NIFORM L OADING AT 80 P ERCENT C OVERAGE (40)
F IGURE 3-1: P OWER-U P CLKREQ# T IMING (50)
F IGURE 3-2: CLKREQ# C LOCK C ONTROL T IMINGS (51)
Tables
T ABLE 2-1: C ARD AND S OCKET T YPES C ROSS-C OMPATIBILITY (14)
T ABLE 2-2: S YSTEM C ONNECTOR P HYSICAL R EQUIREMENTS (27)
T ABLE 2-4: S YSTEM C ONNECTOR M ECHANICAL P ERFORMANCE R EQUIREMENTS (27)
T ABLE 2-6: S YSTEM C ONNECTOR E LECTRICAL P ERFORMANCE R EQUIREMENTS (28)
T ABLE 2-8: S YSTEM C ONNECTOR E NVIRONMENTAL P ERFORMANCE R EQUIREMENTS (28)
T ABLE 2-10: M AXIMUM TDP (41)
T ABLE 3-1: PCI E XPRESS M INI C ARD S YSTEM I NTERFACE S IGNALS (45)
T ABLE 3-3: P OWER-U P CLKREQ# T IMINGS (50)
T ABLE 3-5: CLKREQ# C LOCK C ONTROL T IMINGS (51)
T ABLE 3-7: S IMPLE I NDICATOR P ROTOCOL FOR LED S TATES (53)
T ABLE 3-10: R ADIO O PERATIONAL S TATES (55)
T ABLE 3-11: S YSTEM C ONNECTOR P IN-OUT (57)
T ABLE 3-13: DC S PECIFICATION FOR 3.3V L OGIC S IGNALING (59)
T ABLE 3-14: S IGNAL I NTEGRITY R EQUIREMENTS AND T EST P ROCEDURES (60)
T ABLE 3-16: P OWER R ATINGS (62)
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