CM1412
2-Channel Headset
/ Microphone EMI Filter Array with ESD Protection
Product Description
The CM1412 is a dual, low−pass filter array integrating two pi−style filters (C−R−C) that reduce EMI/RFI emissions while providing ESD protection. This part is custom−designed to interface with a microphone port on a cellular telephone or similar device. Each high quality filter provides more than 35 dB attenuation in the 800 to 2700MHz range. These pi−style filters support bidirectional filtering that control EMI both to and from a microphone element. They also support AC signals, enabling audio signals to pass through without distortion.
In addition, the CM1412 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of ±8kV, the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±15 kV.
The CM1412 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1412 incorporates OptiGuard t coating which results in improved reliability at assembly and is available in a space−saving, low−profile Chip Scale Package with lead−free finishing.
Features
•Functionally and Pin Compatible with ON Semiconductor’s CSPEMI202A
•OptiGuard t Coated for Improved Reliability at Assembly •Two Channels of EMI Filtering
•Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) Network
•Greater than 40 dB Attenuation at 1 GHz
•±8 kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
•±15 kV ESD Protection on Each Channel (HBM)•Supports AC Signals−Ideal for Audio Applications
•Chip Scale Package Features Extremely Low Lead Inductance for Optimum Filter and ESD Performance
•5−Bump, 0.930 mm X 1.410 mm Footprint Chip Scale Package (CSP)
•These Devices are Pb−Free and are RoHS Compliant
Applications
•EMI Filtering and ESD Protection for Headset Microphone Ports
•Wireless Handsets
•Handheld PCs / PDAs
•MP3 Players •Digital Camcorders
•Notebooks
•Desktop PCs
MARKING DIAGRAM
Device Package Shipping†
ORDERING INFORMATION
onsemi
CM1412−03CP WLCSP5
(Pb−Free)
3500/T ape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
WLCSP5
CP SUFFIX
CASE 567AZ
CB= CM1412−03CP
磷酸盐缓冲液BLOCK DIAGRAM
GND
CB
Table 1. PIN DESCRIPTIONS
Pin Name Description
A1MIC_IN1Microphone Input 1 (from Microphone)A3MIC_IN2Microphone Input 2 (from Microphone)
B2GND
Device Ground
C1MIC_OUT1Microphone Output 1 (to Audio Circuitry)C3
90后炫富女MIC_OUT2
Microphone Output 2 (to Audio Circuitry)
衣有年轮PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
Bottom View (Bumps Up View)
CM1412
WLCSP5 Package
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating Units Storage Temperature Range −65 to +150
°C DC Power per Resistor 100mW DC Package Power Rating
200
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Rating Units Operating Temperature Range
–40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol Parameter
Conditions
Min Typ Max Units R Resistance
61
68
75W R MATCH
Resistance Matching 5%C Capacitance
38
47
56pF I LEAK Diode Leakage Current V IN = 5.0 V 1.0m A V SIG
Signal Voltage Positive Clamp Negative Clamp
I LOAD = 10 mA
5−157−10
15−5
V
V ESD
In −system ESD Withstand Voltage
a) Human Body Model, MIL −STD −883, Method 3015b) Contact Discharge per IEC 61000−4−2 Level 4(Notes 2 and 4)±15±8
kV
V CL
Clamping Voltage during ESD Discharge MIL −STD −883(Method 3015), 8 kV Positive Transients Negative Transients
(Notes 2, 3 and 4)
+15−19
V
f C
Cut −Off Frequency, Z SOURCE = 50 W , Z LOAD = 50 W
R = 68 W , C = 47 pF
60
MHz
1.T A = 25°C unless otherwise specified.
2.ESD applied to input and output pins with respect to GND, one at a time.
3.Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1.
4.Unused pins are left open.
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A3−C3 to GND B2)
铅锑合金Parameter
Value Pad Size on PCB 0.240 mm
Pad Shape Round
Pad Definition Non −Solder Mask defined pads
Solder Mask Opening 0.290 mm Round Solder Stencil Thickness
0.125 mm − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls)0.300 mm Round Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball ±50 m m Solder Ball Side Coplanarity
±20 m
m Maximum Dwell Time Above Liquidous
60 seconds Maximum Soldering Temperature for Lead −free Devices using a Lead −free Solder Paste
260°C
Figure 3. Recommended Non −Solder Mask Defined Pad Illustration
Non −Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.Solder Mask Opening
0.290 mm DIA.
Figure 4. Lead −free (SnAgCu) Solder Ball Reflow Profile
Time (minutes)
T e m p e r a t u r e (5C )
PACKAGE DIMENSIONS
WLCSP5, 0.94x1.41CASE 567AZ −01
ISSUE O
NOTES:
1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2.CONTROLLING DIMENSION: MILLIMETERS.
欧拉角3.COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS.
2X DIM A MIN MAX 0.56MILLIMETERS A1D 0.94 BSC E b 0.290.35eD 0.50 BSC 0.720.210.271.41 BSC eE
0.435 BSC
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
BOTTOM VIEW
A20.40 REF RECOMMENDED
OUTLINE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be valid
ated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
OptiGuard is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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