▣ Item : Mold package
SQIS-PDP-024-01Samsung SDI PDP Division Parchasing Team
Quality Process Audit
Author : Kim Dae-Hee Department : Purchasing Date : 05.01.01 Security Level : Normal
Quality Process Audit Check Sheet [Mold package]
□ Evaluation Basic Information
□ Evaluation Sumary
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□ Evaluation Scoring
Assig ned Score Achie ved Score
Assig ned Score Achie ved Score
15
0330
901903103102501703109090170901302830.015
1000.0
Total Score Evaluation Outgoing Test/Outgoing
Forming Marking Test/Bake
Tin Plating Trimming External Appearance Test
※ Scoring 9pt(21ea,23.3%):Items for affecting directly to PDP performance and safety quality
(90ea items) 3pt(38ea,42.2%):Items for affecting indirectly to abnormality in PDP process, or causing supplier's process quality problem 1pt(31ea,34.4%):Basic items for requiring supplier's process control
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Company Name Auditee Name
Audit Date Audit Cycle
Eval Process Common Items
Audit Department Auditor Name
Eval Process
Packing
Product Warehouse
aterial Management(Incoming Tes Wire Bonding Molding Sawing Die Attach 0%
20%40%60%80%100%Material Management(I …吉西他滨
Material Management(I …
Quality Process Audit Check Sheet [Mold package]
111313131113311339319993
4.Are the non-confirming materials kept separately and controlled with records?1.3 Is the operator understanding the content and Spec for operating process?1.4 Is it defined and documented the Spec for changing peroid of sawing blade?
5.Is there specifications for incoming test of each items and controlled well?
6.Is the supplier controlling quality specifications and objectives for incoming test and keeping controlling afterward?
7.Is the reliability data periodically submitted or reviewed by supplier itself?凉子木
8.Is the supplier establishing the developing plans for failure items and controlling afterwards?
1.5 Is it defined the standard for good and NG for sawing process?
2.1 Is the operating guidance or instruction sheet for die attaching process placed at adequate position where the operator can easily refer to?
2.2 Is it uniform for amount of epoxy liniment for lead frame and die by using automatic equipment?
2.3 Is it defined and documented the Spec for epoxy standard?面子理论 Die Attach 2.4 Is it standardized and sufficient for time to drying epoxy after die attaching process?
2.5 Is it defined the control standard for failure device after die attaching process?
Detailed Items
Material
Management
(Incoming Test)Manufacturing Process
9.Are all of the operators understanding the checking items and testing exactly?
1.Is the FIFO controlled reasonably by using labelling or storing in the rack?llr
2.Is it setup the control standard for long-term stocks and utilized after evaluating its usefulness?
3.Is it setup the ESD protection circuit for the equipments sensitive for ESD?
Sawing
1.Is FIFO managed by LOT code?
2.Is the status of stocking and delivering managed by LOT code?
1.1 Is the operating guidance or instruction sheet for sawing process placed at adequate position where the operator can easily refer to?
1.2 Is the wafer to be sawed and sawing program systematically checkable?Audit Result
Product Warehouse 3.Is the supplier managing the devices not to be mixed up when storing?
4.Is it traceable the device LOT code? (production date, major processes, etc)
5.Is it clean for device storage place?
※ Scoring A(x 1.0) : Observed specification well and controlled well
B(x 0.8) : Observed specification well but not controlled well (no action when problem occues and so on)
C(x 0.4) : Not observed specification well (changed condition caused by failure but not changed spec
ification) D(x 0.0) : Controlled without specification (regarded as not controlled)
Weight Result
13999199331913319993133
6.3 Is there Spec of lead plating(Sn/Pb) for IC lead and utilized according to Spec?
7.3 At forming, is there no damage for leads bent and gilt thickness?
B(x 0.8) : Observed specification well but not controlled well (no action when problem occues and so on)
C(x 0.4) : Not observed specification well (changed condition caused by failure but not changed specification) D(x 0.0) : Controlled without specification (regarded as not controlled)
5.2 Is it defined and documented the Spec for changing peroid of blade in the trimming equipment?
5.3 Is the operator understanding the content and Spec for operating process?5.4 Is it checked and t
ested the removal dambar after trimming?5.5 Is it defined the standard for good and NG for trimming process?
6.1 Is the operating guidance or instruction sheet for tin plating placed at adequate position where the operator can easily refer to?
6.2 Is it operated the same condition with soldering Spec for IC lead?
4.2 Is it utilized the Spec for raw material of molding compound standardized?
4.3 Is there Spec for temperature and stress condition for molding equipment and kept well?
4.4 Is it avoidable to be crashed by each molded devices when traying after molding?
4.5 Is it totally checked the remaining BURR after BURR FLASH?
5.1 Is the operating guidance or instruction sheet for trimming placed at adequate position where the operator can easily refer to?
Detailed Items
3.3 Is there standards for bonding capillary and wire width and used according to standard?
3.4 Is it defined clearly Spec for repairing and scraping at failure of wire bonding?
3.5 Is there Spec for attraction and tension for wire bond and managed the data according to LOT code?
4.1 Is the operating guidance or instruction sheet for molding placed at adequate position where the operator can easily refer to?
Wire Bonding Molding
Trimming
Manufacturing Process
3.1 Is the operating guidance or instruction sheet for wire bonding placed at adequate position where the operator can easily refer to?
3.2 Is there standard for the temperature control of die chuck and managed according to standard?
Tin Plating
Forming 6.4 After IC lead plating, is it identical the Spec for cleaning and drying to the conditions used ?
6.5 After tin/soldering, are there standards for controlling good and NG devices and managing NG devices?
7.1 Is the operating guidance or instruction sheet for forming placed at adequate position where the operator can easily refer to?
7.2 Is it standardized the forming process and managed according to standard?
Audit Result
Weight Result
1113131193311331113333
10.2 Is there visual inspection pass/fail criteria in spec? Do they follow the spec?
10.3 Are they categorize visual inspection fails and report to related process unit for improvement?
10.4 Is there division separately between before testing and after testing devices?
10.5 Do they have manual for failed product processing after visual inspection? Is there any preventation method for product mixing? 11.1 Is the operating guidance or instruction sheet for packing placed at adequate position where the operator can easily refer to?
11.2 Do they follow manual for product packing and bar code processing? Is there any difference between packing product and bar code spec?
9.1 Is the operating guidance or instruction sheet for test & baking placed at adequate position where the operator can easily refer to?
9.2 Is it all tested according to the same condition with Spec for functional test items?
9.3 Is it mainly controlled for internal stress and leakage current?
9.4 Do they have clear criteria for pass/fail including binning classification after test process?
9.5 Do they have a criteria for moisture absorption after baking process? Are they do vacuum processing just after baking?
10.1 Is the operating guidance or instruction sheet for visual inspection placed at adequate position where the operator can easily refer to?
7.4 After forming, is there warranty for IC lead and testing by visual inspection?
7.5 After forming, are there standards for controlling good and NG devices and managing NG devices?
8.1 Is the operating guidance or instruction sheet for marking placed at adequate position where the operator can easily refer to?
8.2 Is it standardized the marking process and managed according to standard?
8.3 Is there Spec of managing beam source for laser marking equipment and kept well?
8.4 At marking, is it distinguishable the IC LOT weekly base?
8.5 After marking, are there standards for controlling good and NG devices and managing NG devices?
Detailed Items
Forming
Marking Packing
Test/Bake Visual Inspection
Manufacturing Process
B(x 0.8) : Observed specification well but not controlled well (no action when problem occues and so on)
C(x 0.4) : Not observed specification well (changed condition caused by failure but not changed specification) D(x 0.0) : Controlled without specification (regarded as not controlled)
李瑞海
11.4 Are they follow the manual for using Silicagel in sealed bag?
11.5 Is there any possibility of product mixing and product mamages in site ?
11.3 Are they properly attached temp/humidity sensitivity label? Are they verify whether the label works well?
Audit Result
Weight Result
13191333333393
1.Are all the specifications updated/revised properly?
2.Is there any mismatches between vendor's outgoing inspection results and SDI incoming inspection specs and qualification report?
1.Is there contamination management plan with responsible person?
2.Is the contamination manament plan executed regulary?
3.Are they doing contamination management and 5S training for related personnels in factory?
1.Is there ESD management spec? Are they check it a regular basis? 1
2.1 Is the operating guidance or instruction sheet for outgoing inspection/shipment placed at adequate position where the operator can easily refer to?
12.2 Do they have manual for failed lot processing in outgoing inspection? Are they follow the manual?
12.3 Do the operators have wrist strap when they handle outgoing test devices to avoid ESD damage?
12.4 Are they keep the manual of outgoing inspection sampling spec and after-inspection sample process? 12.5 Is there any possibility of shipment mixing? Are they have controlled plan to prevent shipment mixing ?
1.Are they ready to maintain test equipment system with regular based correction for errors?
3.Are the equipment and facilities ready to ESD protection?
B(x 0.8) : Observed specification well but not controlled well (no action when problem occues and so on)
C(x 0.4) : Not observed specification well (changed condition caused by failure but not changed specification) D(x 0.0) : Controlled without specification (regarded as not controlled)
Commo n Items Test equipment Specification
Contaminati on management ESD
manageme nt 2.Are all the personnels wearing earth-ring(1MOhm)?
Audit Result
Manufacturing Process
Detailed Items
Weight Result Outgoing inspection/Shipment
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