JOINT INDUSTRY STANDARD
Acoustic Microscopy for Non-Hermetic
Encapsulated
Electronic
Components IPC/JEDEC J-STD-035
APRIL1999
Supersedes IPC-SM-786 Supersedes IPC-TM-650,
2.6.22
Notice EIA/JEDEC and IPC Standards and Publications are designed to serve the
public interest through eliminating misunderstandings between manufacturers
and purchasers,facilitating interchangeability and improvement of products,
and assisting the purchaser in selecting and obtaining with minimum delay
the proper product for his particular need.Existence of such Standards and
Publications shall not in any respect preclude any member or nonmember of
EIA/JEDEC or IPC from manufacturing or selling products not conforming
to such Standards and Publications,nor shall the existence of such Standards
and Publications preclude their voluntary use by those other than EIA/JEDEC
and IPC members,whether the standard is to be used either domestically or
internationally.
Recommended Standards and Publications are adopted by EIA/JEDEC and
IPC without regard to whether their adoption may involve patents on articles,
materials,or processes.By such action,EIA/JEDEC and IPC do not assume
any liability to any patent owner,nor do they assume any obligation whatever
to parties adopting the Recommended Standard or Publication.Users are also
wholly responsible for protecting themselves against all claims of liabilities for
patent infringement.
The material in this joint standard was developed by the EIA/JEDEC JC-14.1
Committee on Reliability Test Methods for Packaged Devices and the IPC
Plastic Chip Carrier Cracking Task Group(B-10a)
The J-STD-035supersedes IPC-TM-650,Test Method2.6.22.
For Technical Information Contact:
Electronic Industries Alliance/ JEDEC(Joint Electron Device Engineering Council)
2500Wilson Boulevard Arlington,V A22201
Phone(703)907-7560
Fax(703)907-7501IPC
2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700
Fax(847)509-9798
Please use the Standard Improvement Form shown at the end of this
document.
©Copyright1999.The Electronic Industries Alliance,Arlington,Virginia,and IPC,Northbrook,Illinois.All ri
ghts reserved under both international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.
IPC/JEDEC J-STD-035
Acoustic Microscopy
for Non-Hermetic Encapsulated
Electronic
Components
A joint standard developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPC
Users of this standard are encouraged to participate in the development of future revisions.
Contact:
固定式
EIA/JEDEC Engineering Department 2500Wilson Boulevard Arlington,V A22201 Phone(703)907-7500 Fax(703)907-7501IPC
2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700
Fax(847)509-9798
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
风流茶
说合Acknowledgment
Members of the Joint IPC-EIA/JEDEC Moisture Classification Task Group have worked to develop this document.We would like to thank them for their dedication to this effort.Any Standard involving a complex technology draws material from a vast number of sources.While the principal members of the Joint Moisture Classification Working Group are shown below,it is not possible to include all of those who assisted in the evolution of this Standard.To each of them,the mem-bers of the EIA/JEDEC and IPC extend their gratitude.
IPC Packaged Electronic Components Committee Chairman
Martin Freedman
AMP,Inc.
IPC Plastic Chip Carrier Cracking Task Group,B-10a Chairman
Steven Martell
Sonoscan,Inc.EIA/JEDEC JC14.1
Committee
Chairman
Jack McCullen
Intel Corp.
EIA/JEDEC JC14
Chairman
Nick Lycoudes
Motorola
Joint Working Group Members
Charlie Baker,TI
Christopher Brigham,Hi/Fn
Ralph Carbone,Hewlett Packard Co. Don Denton,TI
Matt Dotty,Amkor
Michele J.DiFranza,The Mitre Corp. Leo Feinstein,Allegro Microsystems Inc.
Barry Fernelius,Hewlett Packard Co. Chris Fortunko,National Institute of Standards
Robert J.Gregory,CAE Electronics, Inc.
Curtis Grosskopf,IBM Corp.
Bill Guthrie,IBM Corp.
Phil Johnson,Philips Semiconductors Nick Lycoudes,Motorola
Steven R.Martell,Sonoscan Inc. Jack McCullen,Intel Corp.
Tom Moore,TI
David Nicol,Lucent Technologies Inc.
Pramod Patel,Advanced Micro Devices Inc.
Ramon R.Reglos,Xilinx
Corazon Reglos,Adaptec
Gerald Servais,Delphi Delco Electronics Systems
Richard Shook,Lucent Technologies Inc.
E.Lon Smith,Lucent Technologies Inc.Randy Walberg,National
Semiconductor Corp.
Charlie Wu,Adaptec
Edward Masami Aoki,Hewlett
Packard Laboratories
司马义艾买提Fonda B.Wu,Raytheon Systems Co.
Richard W.Boerdner,EJE Research
Victor J.Brzozowski,Northrop
Grumman ES&SD
Macushla Chen,Wus Printed Circuit
Co.Ltd.
Jeffrey C.Colish,Northrop Grumman
Corp.
Samuel J.Croce,Litton Aero
Products Division
Derek D-Andrade,Surface Mount
Technology Centre
Rao B.Dayaneni,Hewlett Packard
Laboratories
Rodney Dehne,OEM Worldwide
James F.Maguire,Boeing Defense&
Space Group
荣辱观教育
Kim Finch,Boeing Defense&Space
Group
Alelie Funcell,Xilinx Inc.
Constantino J.Gonzalez,ACME
Munir Haq,Advanced Micro Devices
Inc.
Larry A.Hargreaves,DC.Scientific
Inc.
牛田洋事件John T.Hoback,Amoco Chemical
Co.
Terence Kern,Axiom Electronics Inc.
Connie M.Korth,K-Byte/Hibbing
Manufacturing
Gabriele Marcantonio,NORTEL技术创新的重要性
Charles Martin,Hewlett Packard
Laboratories
Richard W.Max,Alcatel Network
Systems Inc.
Patrick McCluskey,University of
Maryland
James H.Moffitt,Moffitt Consulting
Services
Robert Mulligan,Motorola Inc.
James E.Mumby,Ciba
John Northrup,Lockheed Martin
Corp.
Dominique K.Numakura,Litchfield
Precision Components
Nitin B.Parekh,Unisys Corp.
Bella Poborets,Lucent Technologies
Inc.
D.Elaine Pope,Intel Corp.
Ray Prasad,Ray Prasad Consultancy
Group
Albert Puah,Adaptec Inc.
William Sepp,Technic Inc.
Ralph W.Taylor,Lockheed Martin
Corp.
Ed R.Tidwell,DSC Communications
Corp.
Nick Virmani,Naval Research Lab
Ken Warren,Corlund Electronics
Corp.
Yulia B.Zaks,Lucent Technologies
Inc.
IPC/JEDEC J-STD-035April1999 ii
Table of Contents
1SCOPE (1)
2DEFINITIONS (1)
2.1A-mode (1)
2.2B-mode (1)
2.3Back-Side Substrate View Area (1)
2.4C-mode (1)
2.5Through Transmission Mode (2)
2.6Die Attach View Area (2)
2.7Die Surface View Area (2)
2.8Focal Length(FL) (2)
2.9Focus Plane (2)
2.10Leadframe(L/F)View Area (2)
2.11Reflective Acoustic Microscope (2)
2.12Through Transmission Acoustic Microscope (2)
2.13Time-of-Flight(TOF) (3)
2.14Top-Side Die Attach Substrate View Area (3)
3APPARATUS (3)
3.1Reflective Acoustic Microscope System (3)
3.2Through Transmission Acoustic
Microscope System (4)
4PROCEDURE (4)
4.1Equipment Setup (4)
4.2Perform 4Appendix A Acoustic Microscopy Defect Check
Sheet (6)
Appendix B Potential Image Pitfalls (9)
Appendix C Some Limitations of Acoustic
Microscopy (10)
Appendix D Reference Procedure for Presenting
Applicable Scanned Data (11)
Figures
Figure1Example of A-mode Display (1)
Figure2Example of B-mode Display (1)
Figure3Example of C-mode Display (2)
Figure4Example of Through Transmission Display (2)
Figure5Diagram of a Reflective Acoustic Microscope
System (3)
Figure6Diagram of a Through Transmission Acoustic
Microscope System (3)
April1999IPC/JEDEC J-STD-035
iii
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