巡线机器人郭亮龙董会黄姝珂潘金龙
(中国工程物理研究院机械制造工艺研究所，四川绵阳621999)
设i t与研究 D e s ig n a n d R e se a rch_______________________________________________2020年第6期
摘要：无磨粒化学机械抛光是一种柔和的表面处理方法，可以有效去除磷酸二氢钾（KDP)晶体表面的小尺度飞切刀纹。在抛光过程中不使用磨粒,KDP晶体与抛光垫粗糙峰直接接触，两者之间相对运 动，在表面接触应力的作用下，抛光堅对KDP晶体表面产生微机械作用，在实现材料去除和改善表
面质量方面具有重要的作用。为了深入了解无磨粒化学机械抛光中微机械去除作用，文章通过研究
合成氨反应表面接触应力分布和变化规律，对抛光过程中的微机械作用进行定量分析，建立了 KDP晶体与抛
光垫粗糖峰接触力学的数学模型并开展系统研究。根据Hertz理论对抛光过程中KDP晶体表面接
触应力进行了计算与分析，研究了抛光压力、摩擦系数、抛光垫杨氏模量和抛光塾粗糙峰半径等抛光
参数对微机械作用的影响规律，获得了不同抛光条件下最大许用抛光压力。结合实验结果，对KDP
晶体与抛光垫之间的微机械作用进行了实验验证，进一步揭示了 KDP晶体无磨粒化学机械抛光去
除机理。
关键词：磷酸二氢钾晶体；无磨粒化学机械抛光；表面接触应力；微机械作用；力学模型；仿真
中图分类号:TH162 文献标识码:A
DOI：10.19287/jki.1005-2402.2020.06.008
Modeling and simulation of micro-mechanical interaction in KDP abrasive-free polishing
GUO Lianglong,DONG H u i,HUANG Shuke,PAN Jinlong
(Institute of Machinery Manufacturing Technology, China Academy of Physical
Engineering (CAEP) , Mianyang 621999, CHN )
无极论坛
Abstract： Abrasive free chemical mechanical polishing can effectively remove the flying cutter patte
rn remaining on the KDP surface after the KDP fly-cutting. During the polishing process, the KDP and the polishing pad
ISO 14644asperities rubber together. There is micro-mechanical effect in the process that affects the final polishing
effect. In this paper, the mathematical model of KDP and polishing pad asperities was established. Ac
cording to Hertz theory, the surface contact stress of KDP crystal during polishing was calculated and an
alyzed. The polishing pressure, friction coefficient, Young^s modulus of polishing pad and asperity radius
of polishing pad were studied. The influence of polishing parameters on the micro-mechanical action was
obtained, and the maximum allowable polishing pressure was obtained under different polishing condi
tions. In addition, the mechanical effects between KDP and polishing pad were further analyzed in com
bination with the experimental results, and the mechanism of chemical mechanical polishing removal of
KDP based on microemulsion was further revealed.
我的老师璐君Key w ords： potassium dihydrogen phosphate crystal; non-abrasive chemical mechanical polishing；surface contact stress；micromechanical action；modeling；simulation
K D P晶体具有优良的非线性光学性能，用于激光 约束核聚变等光学装置的倍频晶体元件。因其具有软 脆、易潮解、温度敏感以及各向异性等特点，是一种极 难加工材料。目前，单点金刚石飞切（single point diamond turning,SPDT)是能够加工出满足工程要求KDP 晶体的唯一工艺手段，能够实现K D P晶体的超精密加 工，但是会在晶体表面产生飞切刀纹、表面损伤（划 痕、凹坑等）和亚表面损伤（亚表面变质层），给晶体的
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