毕业设计（论文）
专 业
苯丙氨酸班 次
姓 名
指导老师
成都工业学院
vep二0 0九年六月
市场 营销摘 要
封装作为微电子产业的三大支柱之一，在微电子产业中的地位越来越重要。随着微电子产业不断的发展，轻型化，薄型化，小型化的微小间距封装成为发展需要。而封装的相关失效成为制约封装向前发展的瓶颈。本文通过大量的调研文献，对封装失效分析的目的，内容和现状进行总结，并对封装失效分析的未来发展进行展望。 本文的主题是对封装中最重要的两个方面引线键合和塑料封装材料产生的相关失效进行归纳总结。本文从封装在微电子产业中的作用出发，引出对封装的失效进行分析的重要性，并说明了国内外封装产业的差距。对失效的基础概念，失效的分类进行了阐述；总结了进行失效分析的相关流程和进行失效分析最基本的方法和仪器。对封装中最普遍的引线键合工艺和塑封工艺分别进行了分析。对比了传统的Au线，Al线与Cu线键合工艺，说明了Cu引线键合技术代替传统的键合技术成为主流键合工艺的必然性；对Cu引线键合技术中出现的相关失效问题和国内外的研究结果进行了分析归纳。对塑料封装材料的发展进行了说明，指出环氧树脂为主流塑料封装材料的原因；对环氧树脂的组成以及在使用环氧树脂过程中出现的相关失效进行了归纳，并总结了环氧树脂未来的发展方向。
关键词：电子封装, 失效分析, 引线键合, 铜线, 环氧树脂
长宽比
Abstract
Package as one of the three backbones in Microelectronics industry is more important than before in it. As the development of the Microelectronics industry, it requires thin, small, fine pitch package. 乩童But the correlative failures become the bottleneck of its development. This paper summarizes the purpose, the content and the development of packaging failure analysis from lots of researching papers, finally pointing out the future of it.
This paper concludes and summarizes the failures resulting from wire bonding and plastic packaging material, which are two of the most important things in package. First, It concludes the basic concept and the category of package, and then how to do failure analysis. Destructive physical analysis and some microscope equipments used normally are showed. Wire bonding technics and encapsulation technics are analyzed separately. Contrasting the copper wire bonding and the conventional gold wire bonding or aluminum 人均国民收入
wire bonding, this paper points out the inevitability that the copper wire bonding becomes the mainstream wire bonding technics by replacing conventional ones. And then it summarizes the correlative failures and the study results about the new technology. After that, it says the history of encapsulation materials and the reasons why epoxy-molding compound is the mainstream. Then this paper explains the composition of the epoxy-molding compound and concludes the correlative failures about it. Lastly this paper points out the future direction of it.
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