TMS320F2810, TMS320F2810-Q1, TMS320F2811, TMS320F2811-Q1
TMS320F2812, TMS320F2812-Q1
不要闭上眼睛>卢新华
SPRS174V – APRIL 2001 – REVISED FEBRUARY 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback17 Product Folder Links: TMS320F2810TMS320F2810-Q1TMS320F2811TMS320F2811-Q1TMS320F2812
TMS320F2812-Q1
TMS320F2810, TMS320F2810-Q1, TMS320F2811, TMS320F2811-Q1
TMS320F2812, TMS320F2812-Q1
SPRS174V – APRIL 2001 – REVISED FEBRUARY 2021
8.9 Thermal Resistance Characteristics for 176-Pin PGF Package两票系统
(1)These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
薛晓棠JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/
JEDEC standards:
•JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection
(Still Air)
•JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
8.10 Thermal Resistance Characteristics for 128-Pin PBK Package
(1)These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/
JEDEC standards:磨砂玻璃
•JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
•JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
8.11 Thermal Design Considerations
东台杀人Based on the end application design and operational profile, the I DD and I DDIO currents could vary. Systems that exceed the recommended maximum power dissipation in the end product may require additional thermal enhancements. Ambient temperature (T A) varies with the end application and product design. The critical factor that affects reliability and functionality is T J, the junction temperature, not the ambient temperature. Hence, care should be taken to keep T J within the specified limits. T case should be measured to estimate the operating junction temperature T J. T case is normally measured at the center of the package top-side surface. The thermal application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and definitions. 26Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TMS320F2810TMS320F2810-Q1TMS320F2811TMS320F2811-Q1TMS320F2812
TMS320F2812-Q1
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