一综合词汇
印制电路：printed circuit
印制线路：printed wiring
印制板电路：printed circuit board (PCB)
印制线路板：printed wiring board(PWB)
印制元件：printed component
印制接点：printed contact
印制板装配：printed board assembly
板：board
单面印制板：single-sided printed board(SSB)
双面印制板：double-sided printed board(DSB)
多层印制板：mulitlayer printed board(MLB)
多层印制电路板：mulitlayer printed circuit board
多层印制线路板：mulitlayer prited wiring board
刚性印制板：rigid printed board
刚性单面印制板：rigid single-sided printed borad
刚性双面印制板：rigid double-sided printed borad
刚性多层印制板：rigid multilayer printed board
挠性多层印制板：flexible multilayer printed board 挠性印制板：flexible printed board
挠性单面印制板：flexible single-sided printed board
挠性双面印制板：flexible double-sided printed board
挠性印制电路：flexible printed circuit (FPC)
挠性印制线路：flexible printed wiring
刚性印制板：flex-rigid printed board, rigid-flex printed board
刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board 齐平印制板：flush printed board
金属芯印制板：metal core printed board
金属基印制板：metal base printed board
多重布线印制板：mulit-wiring printed board
陶瓷印制板：ceramic substrate printed board
芯片测试
导电胶印制板：electroconductive paste printed board
模塑电路板：molded circuit board
模压印制板：stamped printed wiring board
顺序层压多层印制板：sequentially-laminated mulitlayer
散线印制板：discrete wiring board
微线印制板：micro wire board
积层印制板：buile-up printed board
积层多层印制板：build-up mulitlayer printed board (BUM) 积层挠印制板：build-up flexible printed board
表面层合电路板：surface laminar circuit (SLC)
埋入凸块连印制板：B2it printed board
多层膜基板：multi-layered film substrate(MFS)
层间全内导通多层印制板：ALIVH multilayer printed board 载芯片板：chip on board (COB)
埋电阻板：buried resistance board
母板：mother board
子板：daughter board
背板：backplane
裸板：bare board
键盘板夹心板：copper-invar-copper board
动态挠性板：dynamic flex board
静态挠性板：static flex board
可断拼板：break-away planel
电缆：cable
排气阀组
挠性扁平电缆：flexible flat cable (FFC)
薄膜开关：membrane switch
混合电路：hybrid circuit
厚膜：thick film
厚膜电路：thick film circuit
薄膜：thin film
薄膜混合电路：thin film hybrid circuit
互连：interconnection
导线：conductor trace line
齐平导线：flush conductor
传输线：transmission line
跨交：crossover
板边插头：edge-board contact
增强板：stiffener
在线销售系统基底：substrate
基板面：real estate
导线面：conductor side
元件面：component side
焊接面：solder side
印制：printing
网格：grid
图形：pattern
导电图形：conductive pattern
非导电图形：non-conductive pattern
字符：legend
标志：mark
二基材：
基材：base material
层压板：laminate
覆金属箔基材：metal-clad bade material
覆铜箔层压板：copper-clad laminate (CCL) 单面覆铜箔层压板：single-sided copper-clad laminate
双面覆铜箔层压板：double-sided copper-clad laminate 复合层压板：composite laminate
薄层压板：thin laminate
金属芯覆铜箔层压板：metal core copper-clad laminate 金属基覆铜层压板：metal base copper-clad laminate
挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film 基体材料：basis material
预浸材料：prepreg
粘结片：bonding sheet
预浸粘结片：preimpregnated bonding sheer
环氧玻璃基板：epoxy glass substrate 加成法用层压板：laminate for additive process
预制内层覆箔板：mass lamination panel
内层芯板：core material
催化板材：catalyzed board ,coated catalyzed laminate
涂胶催化层压板：adhesive-coated catalyzed laminate
涂胶无催层压板：adhesive-coated uncatalyzed laminate
粘结层：bonding layer
粘结膜：film adhesive
涂胶粘剂绝缘薄膜：adhesive coated dielectric film
无支撑胶粘剂膜：unsupported adhesive film
覆盖层：cover layer (cover lay)
增强板材：stiffener material
铜箔面：copper-clad surface
去铜箔面：foil removal surface
层压板面：unclad laminate surface
基膜面：base film surface
胶粘剂面：adhesive faec
原始光洁面：plate finish
粗面：matt finish
纵向：length wise direction
模向：cross wise direction
剪切板：cut to size panel
酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
超薄型层压板：ultra thin laminate
陶瓷基覆铜箔板：ceramics base copper-clad laminates
紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates
三基材的材料
A阶树脂：A-stage resin
B阶树脂：B-stage resin
C阶树脂：C-stage resin
环氧树脂：epoxy resin
酚醛树脂：phenolic resin
聚酯树脂：polyester resin
聚酰亚胺树脂：polyimide resin
双马来酰亚胺三嗪树脂：bismaleimide-triazine resin
丙烯酸树脂：acrylic resin
三聚氰胺甲醛树脂：melamine formaldehyde resin
多官能环氧树脂：polyfunctional epoxy resin
溴化环氧树脂：brominated epoxy resin
电子签章技术环氧酚醛：epoxy novolac
氟树脂：fluroresin
硅树脂：silicone resin海洋浮标
硅烷：silane
聚合物：polymer
自动拖把
无定形聚合物：amorphous polymer
结晶现象：crystalline polamer
双晶现象：dimorphism
共聚物：copolymer
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