专利名称:Component suction device, component mounting apparatus and component
mounting method
发明人:Kenji Okamoto,Akira Kabeshita,Hideo
Sakon,Yoichi Makino,Ken Takano
申请号:US10130118
申请日:20010918
公开号:US07017261B2
公开日:
20060328
专利附图:
摘要:A component suction device includes a suction nozzle for sucking and holding a
component, a nozzle turning device for holding the suction nozzle and turning the suction nozzle, and a nozzle up-and-down device which is located above the nozzle turning device and which is connected to the suction nozzle for moving up and down the suction nozzle along an axial direction of the suction nozzle.
申请人:Kenji Okamoto,Akira Kabeshita,Hideo Sakon,Yoichi Makino,Ken Takano
地址:Hirakata JP,Hirakata JP,Suita JP,Hirakata JP,Takaishi JP
国籍:JP,JP,JP,JP,JP
代理机构:Wenderoth, Lind & Ponack, L.L.P.