摘要
多线切割是一种通过金属丝的高速往复运动，把磨料带入半导体加工区域进行研磨，将半导体等硬脆材料一次同时切割为数百片薄片的一种新型切割加工方法。数控多线切割机已逐渐取代了传统的内圆切割，成为硅片切割加工的主要方式。硅片是半导体和光伏领域的主要生产材料。硅片多线切割技术是目前世界上比较先进的硅片加工技术，它的原理是通过一根高速运动的钢线带动附着在钢丝上的切割刃料对硅棒进行摩擦，从而达到切割效果。 本文主要以HCT-B6多线切割机的工艺为主。
关键词：多线切割、HCT； 太阳能电池：多晶硅； 恒温恒湿净化实验室
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Multi-wire cutting technology and application
背光片Abstract来书网
Multi-line cut through the metal wire is a high-speed reciprocating motion, the abrasive grinding into the area of semiconductor processing, semiconductor and other brittle materials will cut into hundreds of pieces at one time a new sheet cutting method. CNC cutting machine has been gradually replaced the more traditional inner circle cutting, cutting into the main form of silicon. Silicon is the semiconductor and photovoltaic materials, the main production areas. Multi-line wafer cutting technology is the world's more advanced silicon processing technology, its principle is through a high speed steel wire lead attached to the wire on the cutting edge of the friction material on the silicon rods to achieve the cutting effect.
Keywords: Multi-wire cutting、HCT
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