PCB 工 程 部 专 业 英 文 词 汇
词汇
1.板料: material
2.最低限度: minimum 或者min.
3.最大限度: maximum 或者max.
4.基准点(零点) datum point
5.周期 Date code
6.V-cut余厚 V-cut remain thickness
7.抢电铜皮（假铜） dummy copper
8.实物板 actual board
9.外形及尺寸错误 dimension error 10.异常情形 error data file
11.焊锡面与零件面对位偏差 misregistration
12.孔塞 plug hole
13.要求 requirement
14.缺少 miss
15.偏公差 uneven tolerance
16.补偿 compensation
17.表面处理 surface treatment 18.无铅喷锡 Lead free HAL
19.金手指斜边 bevel of G/F
20.制程能力 process capability
21.建议,暗示 suggest
22.确保 ensure
23.满足,达到 meet
24.为了 in order to
25.交货期 delivery date
26.绿油桥 solder mask bridge 或者 solder mask dam
27.根据 according to
28.单边3mil per side 3 mil
29.直径 diameter
30.半径 radius
31.小于3mil less than 3mil
32.高于3mil more than 3 mil
33.压合结构 stacking structure 或者stack_up
34.附件：attached file
35.样品：sample
36.文档：Document
37.答复：answer; reply
钉角机
38.规格：spec
时效处理设备39.与...同样的：the same as
40.前版本：previous version(old version)
41.生产：production
42.确认：confirm
43.再次确认：confirm again
44.工程问题：engineering query（EQ）
45.尽快：as soon as possible
46.生产文件：production Gerber
47.联系某人：contact somebody
48.提交样板：submit sample
49.交货期：delivery date
50.电测成本：ET（electrical test）cost
51.通断测试：Open and short testing
52.参考：refer to
53.IPC标准：IPC standard
54.IPC二级：IPC class 2
55.可接受的：acceptable
56.允许：permit
57.制造：manufacture 或者 fabricate
58.修改：revision
59.公差：tolerance
60.忽略：ignore
61.工具孔：tooling hole
62.安装孔：mounting hole
63.元件孔：component hole
64.槽孔：slot hole
65.邮票孔：snap off hole 或者stamp hole
66.导通孔：via hole
67.盲孔： blind via hole
68.马胶配方的大全埋孔：buried via hole
69.金属化孔：PTH(plated through hole)
70.非金属化孔：NPTH( no plated through hole)
71.孔位：hole location
72.避免：avoid
73.原设计：original design
74.修改：modify
75.按原设计：follow up original design
76.附边：waste tab, waste area 或者breakaway tab
77.铜条：copper strip
78.拼板：panel drawing
79.板厚：board thickness
80.删除：remove(delete)
81.削铜：shave the copper
82.露铜：copper exposure 或者exposed copper
83.光标点: fiducial mark
84.不同：be different from(differ from)
85.内弧：inside radius
86.焊环：annular ring
87.单板尺寸：single size
88.拼板尺寸：panel size
89.铣,锣：routing
90.铣刀：router 或者Routing bit
91.楔形掏槽 V-cut 或者V scoring
92.哑光：matt
93.光亮的：glossy
94.锡珠：solder ball(solder plugs)
95.阻焊：solder mask(solder resist)
96.阻焊开窗：solder mask opening
97.单面开窗：single side mask opening
98.补油：touch up solder mask
99.补线：track welds
100.毛刺：burrs
101.煤炭水分去毛刺：deburr
102.镀层厚度：plating thickness 103.清洁度：cleanliness
104.离子污染：ionic contamination
105.阻燃性等级：flammability retardant rating
106.黑化：black oxidation
107.棕化：brown oxidation
108.红化：red oxidation
109.可焊性不良：poor solderability
110.焊料：solder
111.包装：packaging
112.角标：corner mark
113.特性阻抗：characteristic impedance
114.正像：positive
115.负片：negative
116.镜像：mirror
117.线宽：line width 或者trace width
118.线距：line spacing 或者 trace spacing
119.做样：build sample
120.按照：according to
121.成品：finished
122.做变更：make the change
123.相类似：similar to
124.规格：specification
125.下移：shift down
126.垂直地：vertically
127.水平的：horizontally
128.增大：increase
129.缩小：decrease
130.表面处理：Surface Finishing
131.波峰焊：wave solder
132.钻孔数据：drilling data
133.标记：Logo
134.Ul 标记：UL logo,或者Ul Marking
135.蚀刻标记：etched marking
136.周期：date code
137.翘曲：bow and twist
138.外层：outer layer 或者 external layer
139.内层：inner layer 或者 internal layer
140.大理石测量平台顶层：top layer
141.底层：bottom layer
142.元件面：component side
143.焊接面：solder side
144.阻焊层：solder mask layer
145.字符层：legend layer (silkscreen layer or over layer)
146.兰胶层：peelable SM layer
147.贴片层：paste mask layer
148.碳油层：carbon layer
149.外形层：outline layer(profile layer)
150.白油：white ink
151.绿油：green ink
152.喷锡：hot air leveling (HAL)
153.电金,水金：flash gold
154.插头镀金：plated gold edge-board contacts
155.金手指：Gold-finger
156.防氧化：Entek (OSP)
157.沉金：Immersion gold (chem. Gold)
158.沉锡：Immersion Tin(chem.Tin)
159.沉银：Immersion Silver (chem. silver)
160.单面板：single sided board
161.双面板：double sided board
162.多层板：multilayer board
163.刚性板：rigid board
164.挠性板：flexible board
165.刚挠板：flex-rigid board
166.铣：CNC (mill , routing)
167.冲：punching
168.倒角：beveling
169.斜面：chamfer
170.倒圆角：fillet
171.尺寸：dimension
172.材料：material
173.介电常数：Dielectric constant
174.菲林：film
175.成像：Imaging
176.板镀：Panel Plating
177.图镀：Pattern Plating
178.后清洗：Final Cleaning
179.叠层：stacking structure (stack-up)
180.污染焊盘：contaminate pad
181.分孔图：drill chart 或者drill map
182.度数：degree
183.被…覆盖：be covered with
184.负公差：minus tolerance
185.标靶盘： target pad
186.外形公差：routing tolerance
187.芯板：core
188.半固化片 Prepreg
189.阻抗线：impedance trace
190.评估 estimate
191.玻纤显露 Fiber Exposure
192.底铜 base copper
193.工作搞 working Gerber
194.原稿 original art work
195.放宽 relax
196.挖空 blanking 或者 cut-out
197.一般性阻焊油墨 general resist ink
198.孔位错误 mis hole location
199.压合周期 press cycle
200.毛边伪随机数 serrated edges
201.跳印 skip printing
202.气泡 blistering
203.隔离焊盘 isolated pad
204.泪滴 tear drops
205.箭头 arrows
206.加大 Enlarge
207.压合周期 press cycle
208.毛边 serrated edges
209.跳印,漏印 skip printing
210.宽度与厚度的比值 width-to-thickness ratio
211.调整 adjust
212.铜箔基板 copper claded laminates
213.线路露铜 copper exposure
214.孔内异物 dirty hole
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