D D
C
C
B B
A A
8/16/2013Sheet Title:
Mod. Date:Change in menu Project|Project Options|Parameters
Project Title:Designed for:Public Release XX####Number:Rev:E1LOGO
PCB Texas Instruments
H1
NY PMS 440 0025 PH
H2
NY PMS 440 0025 PH
H3
NY PMS 440 0025 PH
H4
NY PMS 440 0025 PH
H5
1902C
H6
1902C
H7
1902C
H8
1902C
FID2
FID1
FID3
XX####
E1
PCB Number:PCB Rev:Label Assembly Note
ZZ1
This Assembly Note is for PCB labels only
PCB Label
LBL1
Size: 0.65" x 0.20 "
Assembly Note
ZZ2
These assemblies are ESD sensitive, ESD precautions shall be observed.
Assembly Note
ZZ3
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.Assembly Note
ZZ4
These assemblies must comply with workmanship standards IPC-A-610 Class 2., unless otherwise specified.
D D
C C
B B
A A
8/16/2013Sheet Title:
Mod. Date:Change in menu Project|Project Options|Parameters
Project Title:Designed for:Public Release XX####Number:Rev:E1Revision History
Revision
Notes
Place Block Diagram here (if appropriate) or delete this text box.
If using a block diagram from another tool, save the picture as a .bmp file.
Then, use menu Place|Drawing Tools|Graphic to insert the .bmp file on the schematic.
D
D
C
C
B
B
A
A
12
Cover Sheet 8/19/2013
Sheet Title:Size:Schematic:Mod. Date:Rev:Sheet:of B National Semiconductor and/or its licensors do not warrant the accuracy or completeness of
this specification or any information contained therein. National and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit
for any particular purpose, or will operate in an implementation. National and/or its licensors
Change in menu Project|Project Options|Parameters
Project:Designed for:Public Release 870PRJ_BasePN E1
Assembly Variant:001
Revision History
Revision
Notes
80V
47,8
1,2,3
5,6,
Q2
BSC123N08NS3 G 80V
5,6,Q3
BSC047N08NS3 G
HB130SW225RAMP219EN2
11CSG2
21CS15PGND13VCCDIS 8DEMB 17AGND
12
COMP2
15FB216SS218VIN 29
RAMP16RES 14SW132VCC224HB227HO131VCC11
LO223CS220CSG14COMP110UVLO 28RT 13PGND2
22
D A P
33
HO226FB19SS17LO12U1
LM5119GND
GND
GND
GND
0.005
R190.005R10
0.1µF
C19
GND
0.1µF
C7GND
C27EEF-CD1B220R C28
EEF-CD1B220R
GND
GND
EEF-CD1B220R
GND
GND
2.2uF C1GND GND GND
GND GND GND
2.2uF C2 2.2uF
C32.2uF C20 2.2uF C22 2.2uF
C211.00
R3
0.1µF
C5GND
10.0k
R6
133k
R4
GND
100pF C8GND
4.99k
R22GND
陶瓷防静电活动地板
69.8k
R183.32k R9
0.047µF
C13
100pF C11
0.1uF
C24
GND
2200pF
C232200pF C15GND
GND
0.1uF C14
GND
R13
1uF C16
4.99k
R11
100pF
C17
1.00
R8
1.00
R16
2700pF C122700pF C2973.2k
R23
73.2k
R7D2
BAT46W-7-F
D3
R1
2.49k
R5
GND
0.1uF
C6
GND
10.0k
R2
D1
BAT46W-7-F
80V
4
7,8
1,2,3
5,6,Q1
BSC123N08NS3 G 80V
4
7,8
1,2,3
5,6,
Q5
BSC123N08NS3 G
80V
4
7,8
1,2,3
5,6,Q6
BSC123N08NS3 G GND V
VIN
GND
VOUT
1
1J1
3102-2-00-21-00-00-08-0
1
1J33144-2-00-21-00-00-08-0
1
1J2
3102-2-00-21-00-00-08-0
1
1J4
3144-2-00-21-00-00-08-0
Sync EN2
1µF
C41µF
C18
D4
BAT46W-7-F
VIN VOUT1HB1HO1_P
HO1_N
LO1VCC2
HB2HO2_P HO2_N LO2
CS2
UVLO FB1COMP1
RAMP1SS1RT RES DEMB
VCCDIS EN2
RAMP210.0µH L1
VER2923-103KL
10.0µH
L2
VER2923-103KL CS149.9
R24TP OUT
TP IN
80V
47,8
1,2,3
5,6,Q4
80V
4
7,81,2,3
无镍电镀
5,6,
Q780V
4
7,8
1,2,3
5,6,Q8
100
R25
100
R26
100
R27100
R28
C25
100pF
C26
V C C 1
VIN U1
SS2GND
GND
CSG2CSG1
SYNC 3
1
2
Q9
2DB1694-7
3
1
2
Q10
2DB1694-7
3
1
2
Q11
2DB1694-7
3
1
2
Q12
2DB1694-7
0.7V
D5
0.7V D7
0.7V D6
0.7V D8
GND
GND
CS1_P
GND
CS2_P
GND
Input Voltage = 33Vin to 60Vin
12Vout @ 30A
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