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士兰微电子位于厦门海沧的300mm 芯片生产线于日前正式投产。该生产线项目由厦门士兰集科微电子有限公司负责实施运营，项目总投资170亿元，规划建设两条以功率半导体芯片、MEMS 传感器芯片为主要产品的300mm 特工艺功率半导体芯片生产线。第一条300mm 产线，总投资70亿元，工艺线宽90nm ，计划月产8万片。本次投产的产线就是其中的一期项目，总投资50亿元，规划月产能4万片；项目二期将继续投资20亿元，规划新增月产能4万片。第二条300mm 生产线预计总投资100亿元，将建设工艺线宽65nm 至90nm 的300mm 特工艺芯片生产线。（来自士兰微电子） 69
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