常用芯片封装热阻与功耗

用电信息采集■Thermal Resistance of each package

There are typical measured value based on JEDEC with no wind. Each value is dependent on a chip, a layout of a leadframe, a board, and so forth.

酒精增稠剂

玻璃钢拉挤模具

二苯并萘Notes：

背胶橡皮布1) Thermal resistance values (θja,ψjt) are measured with the 2-layer board having 100mm2 copper foil, which is based on JEDEC.

2) Thermal resistance values (θja,ψjt) are measured with the 4-layer board having thermal via holes, which is also based on JEDEC.

能量传送器

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