铜线工艺介绍Copper wire process instruction Copper wire process instruction 道生液QRA :Oct.2012
铜线工艺介绍
Copper wire process instruction
Copper wire process instruction
Advantages of Copper wire compared to the Gold wire process
f C G
⏹铜线产品业务趋势
Copper wire business development trend
C i b i d l t t d
⏹铜线制程的技术难点及解决方案
Copper wire process technical challenges and solutions
干电池手机Copper wire process technical challenges and solutions
⏹铜线产品设计和制造工艺
Copper wire products design and manufacturing process
Copper wire products design and manufacturing process
⏹铜线封装判定主要标准
箱型钢The main criteria of Copper wire bonding
The main criteria of Copper wire bonding
1
Advantages between copper wire and gold wire
Advantages between copper wire and gold wire
⏹铜线封装相比金线封装的优势在哪里？
What’s the advantages between copper wire and gold wire?
Physical properties comparison
✓物理性能比较Physical properties comparison
对比类型Contrast type
铜线
Copper wire
金线
Gold wire
备注
Remark
成本Cost
金线是铜线的3-8倍
The price of gold wire is3-8 times more expensive than copper
铜线成本低
Copper low cost
导电率20℃Conductivity 20℃5.88 4.55
铜线导电性更好
Copper excellent conductivity
电阻率20℃Resistivity 20℃1.6uΩ/cm 2.3uΩ/cm
铜线在相同的线径情况下可承载更大的电流
The same diameter copper can carry larger current
热传导率Thermal conductivity 401W/m*k318W/m*k
铜线热传导好，容易散热
Good thermal conductivity of copper wire, easy to dissipate heat
离子膜烧碱
硬度Hardness 369mn/m2216mn/m2
铜线弧形和一致性好，无塌丝现象
Good arcs and consistency, no sagging wire
抗张强度Tensile Strength 210-370N/mm2120-220N/mm2
Tensile Strength
老化实验Aging test 121天生长1um Cu/Al 化合物
1/121um /day IMC
1天生长8um Au/Al 化合物
8um/day IMC
铜线金属化合物生长慢，可靠性更高
Copper IMC growth slow and high reliability
2
Advantages between copper wire and gold wire Advantages between copper wire and gold wire
⏹铜线封装相比金线封装的优势在哪里？
What’s the advantages between copper wire and gold wire?Physical properties
comparison
✓
物理性能比较
糖果制造
Physical properties comparison 铜线和金线的硬度比较
铜线和金线的抗断裂比较
●与金线相比，铜线的物理性能具有硬度高、抗断裂强度大的特点，在键合工艺方面弧性和一致性好，
无塌丝现象。
Comparison of the hardness of the copper and gold wire
Copper and gold wire relative breaking load
●Compared with gold wire, the physical properties of the copper has higher hardness, fracture
resistance, the arc and consistency in the bonding process, no sagging wire issue
3
Advantages between copper wire and gold wire
Advantages between copper wire and gold wire
⏹铜线封装相比金线封装的优势在哪里？
What’s the advantages between copper wire and gold wire?✓可靠性比较
Reliability Comparison
铜线和金线的金属化合物生长速度比较
Comparison of IMC growth speed between copper and gold wire
铜线和金线的电阻值比较
Comparison of resistance value of copper and gold wire
●与金线焊点相比，铜线电阻小能承受更大的电流并且铜线焊点中的金属间生长速度慢，因此降低了电阻、减小
自动滚喷机
了产热，老化速度减慢并最终提高了焊接可靠性和器件性能。
●Compared with the gold wire, copper wire resistance is smaller can load larger currents ,also IMC growth
4
speed is slower than gold . Copper wire reducing the resistance, heat and slowing aging to improve bonding
reliability and performance of the device.
豫公网安备41160202000603
站长QQ:729038198
关于我们
投诉建议