CC2530F32,CC2530F64
CC2530F128,CC2530F256 www.ti SWRS081B–APRIL2009–REVISED FEBRUARY2011
A True System-on-Chip Solution for2.4-GHz IEEE802.15.4and ZigBee Applications
Check for Samples:CC2530F32,CC2530F64,CC2530F128,CC2530F256
FEATURES–IEEE802.15.4MAC Timer,General-Purpose
Timers(One16-Bit,Two8-Bit)
•RF/Layout
–IR Generation Circuitry – 2.4-GHz IEEE802.15.4Compliant RF
Transceiver–32-kHz Sleep Timer With Capture –Excellent Receiver Sensitivity and–CSMA/CA Hardware Support Robustness to Interference–Accurate Digital RSSI/LQI Support –Programmable Output Power Up to4.5dBm–Battery Monitor and Temperature Sensor –Very Few External Components–12-Bit ADC With Eight Channels and
–Only a Single Crystal Needed for Configurable Resolution Asynchronous Networks–AES Security Coprocessor –6-mm×6-mm QFN40Package–Two Powerful USARTs With Support for –Suitable for Systems Targeting Compliance Several Serial Protocols With Worldwide Radio-Frequency–21General-Purpose I/O Pins
Regulations:ETSI EN300328and EN300(19×4mA,2×20mA)
440(Europe),FCC CFR47Part15(US)and–Watchdog Timer
ARIB STD-T-66(Japan)
•Development Tools
•Low Power
–CC2530Development Kit –Active-Mode RX(CPU Idle):24mA
–CC2530ZigBee®Development Kit –Active Mode TX at1dBm(CPU Idle):29mA
–CC2530RemoTI™Development Kit for –Power Mode1(4μs Wake-Up):0.2mA RF4CE
–Power Mode2(Sleep Timer Running):1μA–SmartRF™Software
–Power Mode3(External Interrupts):0.4μA–Packet Sniffer
–Wide Supply-Voltage Range(2V–3.6V)–IAR Embedded Workbench™Available •Microcontroller
–High-Performance and Low-Power8051APPLICATIONS
Microcontroller Core With Code Prefetch• 2.4-GHz IEEE802.15.4Systems –32-,64-,128-,or256-KB•RF4CE Remote Control Systems(64-KB Flash
and Higher)
In-System-Programmable Flash
•ZigBee Systems(256-KB Flash)–8-KB RAM With Retention in All Power
•Home/Building Automation Modes
•Lighting Systems
–Hardware Debug Support
•Industrial Control and Monitoring
•Low-Power Wireless Sensor Networks •Peripherals
•Consumer Electronics
安全绳网
–Powerful Five-Channel DMA
•Health Care
–Integrated High-Performance Op-Amp and
Ultralow-Power Comparator
Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SmartRF,Z-Stack are trademarks of Texas Instruments.
IAR Embedded Workbench is a trademark of IAR Systems AB.
按摩鞋垫ZigBee is a registered trademark of the ZigBee Alliance. All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.©2009–2011,Texas Instruments Incorporated Products conform to specifications per the terms of the Texas
CC2530F32,CC2530F64
CC2530F128,CC2530F256
SWRS081B–APRIL2009–REVISED FEBRUARY2011www.ti DESCRIPTION
The CC2530is a true system-on-chip(SoC)solution for IEEE802.15.4,Zigbee and RF4CE applications.It enables robust network nodes to be built with very low total bill-of-material costs.The CC2530combines the excellent performance of a leading RF transceiver with an industry-standard enhanced8051MCU,in-system programmable flash memory,8-KB RAM,and many other powerful features.The CC2530comes in four different flash versions:CC2530F32/64/128/256,with32/64/128/2
56KB of flash memory,respectively.The CC2530has various operating modes,making it highly suited for systems where ultralow power consumption is required. Short transition times between operating modes further ensure low energy consumption.
Combined with the industry-leading and golden-unit-status ZigBee protocol stack(Z-Stack™)from Texas Instruments,the CC2530F256provides a robust and complete ZigBee solution.
Combined with the golden-unit-status RemoTI stack from Texas Instruments,the CC2530F64and higher provide a robust and complete ZigBee RF4CE remote-control solution.
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RESET_N XOSC_Q2XOSC_Q1
P2_4P1_7P0_7P2_3P1_6P0_6P2_2P1_5P0_5P1_2P0_2P2_1P1_4P0_4P1_1P0_1P2_0P1_3P0_3P1_0P0_0
B0301-02
CC2530F32,CC2530F64CC2530F128,CC2530F256
www.ti
SWRS081B –APRIL 2009–REVISED FEBRUARY 2011
This integrated circuit can be damaged by ESD.Texas Instruments recommends that all integrated ci
rcuits be handled with appropriate precautions.Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure.Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
©2009–2011,Texas Instruments Incorporated Submit Documentation Feedback
3
CC2530F32,CC2530F64
CC2530F128,CC2530F256
SWRS081B–APRIL2009–REVISED FEBRUARY2011www.ti ABSOLUTE MAXIMUM RATINGS(1)
MIN MAX UNIT
Supply voltage All supply pins must have the same voltage–0.3 3.9V
–0.3VDD+0.3,
Voltage on any digital pin V
≤3.9
Input RF level10dBm Storage temperature range–40125°C
All pads,according to human-body model,JEDEC STD22,method A1142kV ESD(2)
According to charged-device model,JEDEC STD22,method C101500V (1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings
only,and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)CAUTION:ESD sensitive device.Precaution should be used when handling the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT Operating ambient temperature range,T A–40125°C Operating supply voltage2 3.6V ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2530EM reference design with T A=25°C and VDD=3V,unless otherwise noted.
Boldface limits apply over the entire operating range,T A=–40°C to125°C,VDD=2V to3.6V,and f c=2394MHz to
2507MHz.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Digital regulator on.16-MHz RCOSC running.No radio,crystals,or peripherals active.
Medium CPU activity:normal flash access(1),no RAM access
32-MHz XOSC running.No radio or peripherals active.
6.58.9mA
Medium CPU activity:normal flash access(1),no RAM access
32-MHz XOSC running,radio in RX mode,–50-dBm input power,no peripherals active,CPU
20.5mA
idle
32-MHz XOSC running,radio in RX mode at-100-dBm input power(waiting for signal),no
24.329.6mA
peripherals active,CPU idle
Core current
I core
consumption32-MHz XOSC running,radio in TX mode,1-dBm output power,no peripherals active,CPU idle28.7mA
32-MHz XOSC running,radio in TX mode,4.5-dBm output power,no peripherals active,CPU
33.539.6mA
idle
Power mode1.Digital regulator on;16-MHz RCOSC and32-MHz crystal oscillator off;
0.20.3mA
32.768-kHz XOSC,POR,BOD and sleep timer active;RAM and register retention
Power mode2.Digital regulator off;16-MHz RCOSC and32-MHz crystal oscillator off;
12μA
32.768-kHz XOSC,POR,and sleep timer active;RAM and register retention
地址标准化
Power mode3.Digital regulator off;no clocks;POR active;RAM and register retention0.41μA Peripheral Current Consumption(Adds to core current I core for each peripheral unit activated)
Timer1Timer running,32-MHz XOSC used90μA Timer2Timer running,32-MHz XOSC used90μA Timer3Timer running,32-MHz XOSC used60μA
I peri Timer4Timer running,32-MHz XOSC used70μA
Sleep timer Including32.753-kHz RCOSC0.6μA ADC When converting 1.2mA Erase1mA Flash
Burst write peak current6mA (1)Normal flash access means that the code used exceeds the cache storage,so cache misses happen frequently.
GENERAL CHARACTERISTICS
Measured on Texas Instruments CC2530EM reference design with T A=25°C and VDD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT WAKE-UP AND TIMING
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CC2530F32,CC2530F64
CC2530F128,CC2530F256 www.ti SWRS081B–APRIL2009–REVISED FEBRUARY2011 GENERAL CHARACTERISTICS(continued)
Measured on Texas Instruments CC2530EM reference design with T A=25°C and VDD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Digital regulator on,16-MHz RCOSC and32-MHz crystal
Power mode1→active4μs
oscillator off.Start-up of16-MHz RCOSC
Digital regulator off,16-MHz RCOSC and32-MHz crystal
Power mode2or3→active0.1ms
oscillator off.Start-up of regulator and16-MHz RCOSC
Initially running on16-MHz RCOSC,with32-MHz XOSC
0.5ms
OFF
Active→TX or RX
With32-MHz XOSC initially on192μs
RX/TX and TX/RX turnaround192μs RADIO PART
铜管对流散热器
Programmable in1-MHz steps,5MHz between channels RF frequency range23942507MHz
for compliance with[1]
Radio baud rate As defined by[1]250kbps Radio chip rate As defined by[1]2MChip/s Flash erase cycles20k cycles Flash page size2KB
©2009–2011,Texas Instruments Incorporated Submit Documentation Feedback5
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