工 程 英 文 确 认 常 用 词 及 常 用 语 句 汇 总
单词
1. 附件：attached
2. 样品：sample
3. 承认：approval
4. 答复：answer;reply
5. 规格：spec
6. 与...同样的：the same as
防震床
7. 前版本：previous version(old version)
8. 生产：production
9. 确认：confirm
10. 再次确认：double confirm
11. 工程问题：engineering query（EQ）
12. 尽快：ASAP(as soon as possible)
13. 生产文件：production gerber
14. 联系某人：contact somebody
15. 提交样板：submit sample
16. 交货期：delivery date
17. 电测成本：ET（electrical test） cost
18. 通断测试：Open and short testing
19. 参考：refer to
20. IPC标准：IPC standard
21. IPC二级：IPC class 2
22. 可接受的：acceptable
23. 允许：permit
24. 制造：manufacture
25. 修改：revision
26. 公差：tolerance
27. 忽略：ignore(omit)
28. 工具孔：tooling hole
29. 安装孔：mounting hole
30. 元件孔：component hole
31. 槽孔：slot
32. 邮票孔：snap off hole
33. 导通孔：via
34. 盲孔： blind via
35. 埋孔：buried via
36. 金属化孔：PTH(plating through hole)
37. 非金属化孔：NPTH( no plating through hole)
38. 孔位：hole location
39. 避免：avoid
40. 原设计：original design
41. 修改：modify
42. 按原设计：leave it as it is
43. 附边：waste tab
44. 铜条：copper strip
45. 拼板强度：panel strong
46. 板厚：board thickness
47. 删除：remove(delete)
48. 削铜：shave the copper
49. 露铜：copper exposure
50. 光标点：fiducial mark
51. 不同：be different from(differ from)
宝石饰品
52. 内弧：inside radius
53. 焊环：annular ring
54. 单板尺寸：single size
55. 拼板尺寸：panel size
56. 铣：routing
57. 铣刀：router
58. V-cut：scoring
59. 哑光：matt
60. 光亮的：glossy
61. 锡珠：solder ball(solder plugs)
62. 阻焊：solder mask(solder resist)
63. 阻焊开窗：solder mask opening 64. 单面开窗：single side mask opening
65. 补油：touch up solder mask
66. 补线：track welds
67. 毛刺：burrs
68. 去毛刺：deburr
69. 镀层厚度：plating thickness
70. 清洁度：cleanliness
71. 离子污染：ionic contamination 72. 阻燃性：flammability retardant
73. 黑化：black oxidation
74. 棕化：brown oxidation
75. 电子玻璃红化：red oxidation
76. 可焊性：solderability
77. 焊料：solder
78. 包装：packaging
79. 角标：corner mark
80. 特性阻抗：characteristic impedance
81. 正像：positive
82. 负片：negative
83. 镜像：mirror
84. 线宽：conductor width
85. 线距：conductor spacing
86. 做样：build sample
87. 按照：as per
88. 成品：finished
89. 做变更：make the change
90. 相类似：similar to
91. 规格：specification焙烧回转窑
92. 下移：shift down
93. 垂直地：vertically
94. 水平的：horizontally
95. 增大：increase
96. 缩小：decrease
97. 表面处理：Surface Finishing
98. 波峰焊：wave solder
99. 钻孔数据：drilling date
100. 标记：Logo
101. Ul 标记：Ul Marking
102. 蚀刻标记：etched marking
103. 周期：date code
104. 翘曲：bow and twist
105. 外层：outer layer
106. 内层：internal layer
107. 顶层：top layer
108. 底层：bottom layer
109. 元件面：component side
110. 焊接面：solder side
111. 阻焊层：solder mask layer
112. 丝印层：legend layer (silkscreen layer or over layer)
113. 兰胶层：peelable SM layer
114. 贴片层：paste mask layer
115. 碳油层：carbon layer
116. 外形层：outline layer(profile layer)
117. 白油：white ink
118. 绿油：green ink
防爆软启动柜119. 喷锡：hot air leveling (HAL)
120. 水金：flash gold
121. 插头镀金：plated gold edge-board contacts
122. 金手指：Gold-finger
123. 防氧化：Entek(OSP)
124. 沉金：Immersion gold (chem. Gold)
125. 沉锡：Immersion Tin(chem.Tin)
126. 沉银：Immersion Silver (chem. silver)
127. 单面板：single sided board
128. 双面板：double sided board
129. 多层板：multilayer board
130. 刚性板：rigid board
131. 挠性板：flexible board
132. 刚挠板：flex-rigid board
133. 铣：CNC (mill , routing)
134. 冲：punching
135. 倒角：beveling
136. 倒斜角：chamfer
采集程序
137. 倒圆角：fillet
138. 尺寸：dimension
139. 材料：material
140. 介电常数：Dielectric constant
141. 菲林：film
142. 成像：Imaging
143. 板镀：Panel Plating
144. 图镀：Pattern Plating
145. 后清洗：Final Cleaning
146. 叠层：layup (stack-up)
147. 污染焊盘：contaminate pad
148. 度数：degree
149. 被…覆盖：be covered with
150. 负公差：minus tolerance
151. 标靶盘： target pad
152. 外形公差：routing tolerance
153. 芯板：core
154. 蓝胶：Peelable solder mask
155. 亚光黑：Matt Black
156. 工艺边：Strip; Frame;breakaway
157. 飞测：Fly-probe
158. 叠层顺序：the order of layers
159. 槽宽度：slot width
160. 过孔：Vias
161. 挡点：Block pad ward ring
162. 分孔图：drill chart
163. 钻带： drill tape
常用语句
－、厚度
1. 要求孔内铜厚0.001"太紧对我们的生产，建议按IPC二级0.0008"。 The copper thickness of the wall of the plated-through holes is specified 0.001". It's too tight for our production. We suggest as per IPC class 2.that's to say ,It's 0.0008" .
2.要求金手指镀金厚度为1.2-1.5um，我们加工太困难，建议按我们常规0.45um。
The plating thickness of Au in edge contact is specified 1.2-1.5um,it is too tough for us, we suggest following our normal standard ,that is to say 0.45um instead.
3.建议所要求的铜厚2OZ为成品铜厚，而且我们将用基铜1.5OZ电镀到2OZ。
The copper thickness is specified 2OZ .We suggest the finished copper thickness 2OZ. And we will use the base material with 1.5OZ copper thickness and plate to 2OZ for our production.
4.要求锡厚为0.0005-0.003"，我们做不到这么厚，建议按IPC二级，即保证可焊性，
The solder thickness is required to plated 0.0005-0.003" ,We can not reach the requirement .We suggest following IPC class 2 for the solder thickness and we will assure the solderability.
二、公差
1. XXX.的尺寸公差为+/-0.005，这要求是太紧对我们生产，建议公差放松到+/-0.008"。
The tolerance of dimension is specified XXX.+/-0.005" .It is tight for our production .We suggest +/-0.008" instead。
2.在*.pdf文件中要求外形公差为+/-0.005"，建议按IPC 二级+/-0.01"代替。
The profile tolerance is specified +/-0.005" in *.pdf file. We suggest as per IPC class 2，that is to say, it is +/-0.01".
3. 在叠层图中要求板厚公差为+/-0.007"，而notes 1中要求板厚公差为+/-0.005"，他们是不同的，建议0.062"+/-0.007"是可接受的，因为+/-0.005"对我们来说太难控制了。
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