进料检验 Incoming QC Inspection (IQC) IQI
磨片 Wafer Grind Back Grind
贴片 Wafer Mount
甩干 Spinning
划片 Wafer Saw
装片 Die Attach (D/A)
焊丝球焊，打金丝，打线，焊线 Wire Bond (W/B)
热压焊 Thermal Compression Bond (TCB)
烘烤烘箱 Baking Curing
全检三号目检 3rd Optical Inspection (3rd Opt.)
包封塑封 Molding Encapsulation
冲塑冲胶 Degate
后固化 Post Mold Cure (PMC)
切筋冲筋，切中筋 Damcar Cut Trim
去飞边 Deflash
激光打印 Laser marking
油墨打印 Ink UV marking
电镀 Plating
锡铅电镀铅锡电镀 Tin Lead Plating
无铅电镀纯锡电镀 Lead Free Plating Pure Tin Plating
成型 Forming
分离 Singulation
外观检产品出厂检 Out Going Inspection (OGI) 4th Optical Inspection
测试 Test
分选编带 Tape & Rail
包装 Packing
出货 Shipping
组装 Front OF Line (FOL)
芯片 Die
点芯片 Ink Die
引线框 Lead Frame
助焊剂 Flux
导电胶 Epoxy
蓝膜 Blue Tape / Mounting tape 圆片 Wafer
金丝 Gold wire
推晶 Die shear
弧高 Loop Height
弧度 Wire Loop
布线图 Bond diagram
布线错误 Wrong Bonding
焊丝拉力测克，拉丝 Wire Pull 推球金球剥离 Ball shear
细刀 Capillary
扭曲 Bending
翘曲 Bow / Warpage
硅屑 Silicon Dust
沾污 Contaminate
压伤 Dented
变形 Distort
缺角 Chip Die
锡膏回流 Solder Reflow
银厚度 Silver Thickness
毛刺针刺 Burr
塌丝 Depress Wire
超波膜 UV Tape
火山口 Crater Ring
断丝 Broken Wire
昂球 Lifted Bond
飞球 Sky Ball
金属剥落 Lifted Metal
昂楔 Lifted Wedge
高尔夫球 Golf Ball
扁球 Flat Ball
半球 Insufficient Ball Size 不粘 Non-Stick
芯片裂缝 Crack Die 错方向 Wrong Orientation
焊不牢 Incomplete Bond
无焊 No Bonding
翘芯片 Lifted Die
误置芯片 Misplaced Die
芯片装斜 Tilted Die
芯面粘胶 Epoxy On Die
导电胶不足 Insufficient Epoxy
多胶 Excess Epoxy
导电胶气孔 Epoxy Void
导电胶裂缝 Epoxy Crack
金属划伤 Saw Into Metal
擦痕 Scratches
墨溅 Ink Splash
薄膜气泡 Tape Bubbles
边沿芯片 Edge Die
镜子芯片 Mirror Die
飞片 Fly Die
封装 End Of Line (EOL)
排气 Air vent
托块 Insert
刀片 Punch
型腔 Cavity
料饼塑料，树脂，环氧 Mold Compound Mold pallet
基岛 Paddle (PAD) DAP
共面性 Coplanity
点温计 Digimite
空封 Dummy Molded Strip
废胶跑料，废料 Mold Flash
小脚 Gate Remain
脚间距开档，总宽，跨度 Lead Tip to Tip Total Width, Lead Distance.
包封偏差 Molding Mismatch
包封模具 Mold Chase
冲切，成型模具 Dieset
清模 Mold Cleaning
多肉 Package Bump
引线条 Molded Strip
溢胶 Mold Bleed
包反 Wrong Orientation Molding
印偏 Offset Marking
焊丝冲弯 Wire Sweep
错位 Molding Mismatch
偏心 Molding Offset
气孔空洞，气泡 Void
排气不畅 Air Vent Clog
偏脚 Offset Punch
注浇口，进浇口 Injection Gate 1st Gate
上料框 Frame Loader
冲圆 Fan Out
模温 Mold Temperature
表面粗糙 Rough Surface
未填充 Incomplete Mold
料饼醒料 Compound Aging
顶针 Ejector Pin
顶孔顶料孔 Ejector Pin hole
定位块 Locator Block
粘模 Sticky Mold
烘箱 Oven
麻点镀层起毛 Solder Blister
锡桥搭锡 Solder Bridge
镀层起泡拉尖 Solder Bump
镀层剥落 Solder Peel Off
锡丝 Solder Flick
露铜露底材 Expose Copper
细脚小脚 Narrow Lead
镀层厚度 Plating Thickness
变 (发黄，发黑，发花，水渍，酸斑) Discolor (Yellowish, Blacken, Water
Mark)
锡球 Solder Pad
镀层偏厚或偏薄 Thick or Thin Plating
易焊性 Solderability
退锡 Solder Remove
站立高度 Stand Off
切中筋凸出或凹陷 Dambar Protrusion or Intrusion
连筋 Uncut Dambar
脚长 Lead Length
管脚刮伤 Lead Scratches
管脚反翘 Lead Tip Bend
反切 Wrong Orientation Forming.
缺脚缺管，断脚 Missing Lead Broken Lead
裂缝胶体破裂 Crack Package
微裂缝 Micro Crack
崩角缺角，缺损 Chip Package Chip Off
成型角度 Foot angle
共面性 Coplanarity
倒角 Touch Up
印章印记 Marking Layout
断字 Broken character
印记磨糊褪 Fad Mark
打印不良 Illegible Marking
打印字间距 Mark Character Distance
印记倾斜 Slant Marking
漏打 No marking
缺字 Missing Character
错字 Wrong Marking
弄脏 Smear
定位针 Location Pin
烧氢 Hydrogen Frame
扫描打印 Writing laser
模板激光 Mask Laser
常用的术语
集成电路 Integrated Circuit (IC)
塞头 Plug
托盘 Tray
编带, 带盖 Rail, Rail Cover
料管 Tube
静电袋 Anti Static Bag
支持棒 Suspension Bar Fishtail, tie bar 随件单 Traveling Card Run Card
去离子水 D.I. Water
散热片 Heat Sink
品管 Quality Control (QC)
品保 Quality Assurance (QA)
关卡 QC Gate
校验 Calibrate
照明放大镜 Dazor Light Ring Light
显微镜 Microscope
返工 Rework
质量标准 Criteria
扩散批 Wafer Lot Mother Lot
批 Lot
抽样 Sample Size (SS)
良品 Accept Unit (Acc)
不良品 Reject Unit (Rj)
良率 Yield
次品率不良率 Yield Lost
外次率 O.G.I. Yield
X管率 X-ray Yield
目检 Visual Inspection
正面 Top Surface
反面 Bottom surface
冷藏库料饼存放库 Cold Room Compound storage 表面贴装式 Surface Mount Technology (SMT)
报废 Scrap
开短路 Open short
调机 Machine Buy Off
单列直插式 Single Side Lead Insert
双列直插式 Dual Side Lead Insert Type 内控 Internal / In-house Control
在制品 Work In Progress (WIP)
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