When it comes to the process of manufacturing zinc oxide resistor chips, there are several key steps that must be followed in order to produce high-quality products. The first step in the process is to mix zinc oxide powder with a binder material, such as ethyl cellulose, to create a paste that can be used to form the resistor chips. This paste is then applied to a ceramic substrate using a screen printing technique, which allows for precise control over the thickness and shape of the resistive element.
在生产氧化锌电阻片的工艺流程中，有几个关键步骤必须遵循，以生产高质量的产品。在流程中的第一步是将氧化锌粉末与粘结材料（如乙基纤维素）混合，制成一个可以用来形成电阻片的糊状物。然后使用丝网印刷技术将这种糊状物涂抹到陶瓷基板上，这可以精确控制电阻元件的厚度和形状。
Once the paste has been applied to the substrate, the next step in the process is to fire the resistor chips in a kiln at high temperatures. This firing process helps to remove the binder material and sinter the zinc oxide powder, creating a solid and stable resistive element. After
firing, the resistor chips are coated with a protective glaze to improve their durability and reliability.
一旦将糊状物涂抹到基板上，工艺流程的下一步就是在窑炉中高温烧制电阻片。这个烧制过程有助于去除粘结材料并烧结氧化锌粉末，形成坚固稳定的电阻元件。烧结后，电阻片会被涂上保护釉，以提高其耐久性和可靠性。
After coating the resistor chips with a protective glaze, they are then subjected to a series of quality control tests to ensure that they meet the required specifications. These tests may include measuring the resistance value of each chip, checking for any defects or irregularities in the surface, and testing the durability of the chips under various environmental conditions. Only chips that pass all of these tests are deemed acceptable for use in electronic devices.
在电阻片涂上保护釉后，它们会接受一系列的质量控制测试，以确保它们符合所需的规格。这些测试可能包括测量每个电阻片的电阻值，检查表面上是否有任何缺陷或不规则，并在各种环境条件下测试电阻片的耐久性。只有通过所有这些测试的电阻片才被认为符合在电子设 备中使用的标准。
In addition to the manufacturing process itself, there are also important considerations that must be taken into account when working with zinc oxide resistor chips. For example, it is essential to handle the chips with care to avoid damaging the delicate resistive element. Additionally, proper storage and handling procedures should be followed to prevent contamination or degradation of the chips before they are used in electronic devices.
除了制造过程本身，使用氧化锌电阻片还有一些重要的注意事项必须考虑。例如，需要小心处理电阻片，以避免损坏脆弱的电阻元件。此外，在使用电子设备之前，应遵循适当的存储和处理程序，以防止电阻片被污染或降解。
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