鼓芯
郭利静，张力红，武红娟，代瑞慧
(河北农业大学基础课教学部，河北黄骅061100)
摘要：以市场上常见的不同种类树脂制备了多种环氧塑封料，并比较其凝胶化时间、螺旋流动长度、粘度、固化反应速率、弯曲性能、玻璃化温度及粘结强度等性能指标的差异，为IC 封装不同程度要求的基材选择提供一些数据参考。YX-4000H 型环氧和MEH-7800酚醛树脂组合粘结强度为 矫形鞋3.451MPa 、螺旋流动长度为148cm 、粘度为64Pa ·s ，表现出较优的封装工艺性。
关键词：环氧树脂；酚醛树脂；环氧塑封料
中图分类号:TQ323.5,TN305.94文献标识码:A 文章编号:1681-1070(2019)09-0019-05中文引用格式：郭利静，张力红，武红娟，等.常用树脂对IC 封装用环氧塑封料性能影响[J].电子与封装,2019,19(9):19-23.
英文引用格式:GUO Lijing ,ZHANG Lihong,WU Hongjuan,et al.Study on the effect of resin selection on epoxy moulding compound in IC packaging industry[J].Electronics &Packaging,2019,19(9):19-23.
Study on the Effect of Resin Selection on Epoxy Moulding Compound in IC Packaging Industry
GUO Lijing ,ZHANG Lihong,WU Hongjuan ,DAI Ruihui
(Department of Fundamental Teaching,Hebei Agricultural University,Huanghua 061100,China )
环氧树脂阻燃剂Abstract:Epoxy moulding compound was prepared by different types of epoxy resin and phenolic resin ,of which the gel time,spiral flow length,viscosity,curing process,bending properties,bonding strength,glass transition temperature were investigated.This experiment was to provide some base data about selection on epoxy moulding compound in IC packaging industry.Especially,the result showed that the epoxy moulding compound with the combination of YX-4000H epoxy resin and MEH-7800had the spiral flow length of 148cm,bonding strength of 3.451MPa,and viscosity of 64Pa ·
s,which showed excellent encapsulation reliability.Keywords:epoxy resin ;phenolic resin ;epoxy moulding compound
收稿日期:2019-05-30
wifi功率放大器1引言
环氧塑封料(Epoxy moulding compound ，简称EMC )是一种单组份热固性塑料，主要成分是环氧树脂、酚醛树脂、潜伏性促进剂、硅微粉、应力改性剂、蜡、炭黑等，主要应用于电子封装行业[1-3]。近年来，塑料封装技术向薄型化、高密度方向发展，这就要求固化后
从茶叶中提取
的塑封料具有低膨胀系数、低介电常数、低模量、低吸水率、高流动性等特性[4]。环氧塑封料的性能受环氧树脂和酚醛树脂的种类影响很大[5-7]。近年来，学术界在不同种类的环氧树
脂的合成、性能改善方面[8-9]有多方向的研究和探讨，且
多数在研究对象、原料配备、内容深度上各成体系，但
在原料配备，尤其是市售树脂基材选择方面的差异则风力发电汽车
少有报道。为此，本文以市场常用的几种环
氧树脂与19--
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