Features
Applications
Surface Mount Devices Almost anywhere there is a low voltage Lead free deivce power supply,up to DC33V and a load Size 4532mm/1812mils
to be protested,including:
Surface Mount packaging for automated assembly Computer mother board,Modem,USB hub Agency recognition:UL
PDAs &Charger,Analog &digital line card Digital cameras,Dish drivers,CD-ROMs
Model
D E min
max min max min
max
min min 4.37
4.73
3.07
3.41
0.50 1.00
0.300.251.000.30
0.25
A
B
C
锂电池注液机4.37 4.73 3.07 3.410.50 1.004.37 4.73 3.07 3.410.50
1.30
0.300.254.37
4.73 3.07 3.410.50 1.000.300.25MSM050/24/30 4.37 4.73 3.07 3.410.40 1.800.300.25 4.37
4.73 3.07 3.410.40 0.900.300.25
4.37 4.73 3.07 3.410.40 1.300.300.25 MSM125
4.37 4.73 3.07 3.410.60 1.300.300.254.37 4.73 3.07 3.410.40 1.200.300.25 MSM160 4.37 4.73 3.07 3.410.40 1.200.300.25
4.37 4.73 3.07 3.410.50 1.300.300.25 4.37
4.73 3.07 3.410.50 1.500.300.25Test Passive aging Humidity aging Thermal shock Resistance to solvent
Vibration
Maximum surface of the device in the tripped state is 125℃
85℃,85%℃R.H.,168hrs 85℃,to-40℃,13times ±5%typical ±5%typical ±33%typical Ambient operating confitions:-40℃to 85℃
Conditions MIL-STD-202,Method 215MIL-STD-202,Method 201
Resistance change
No change No change
85℃
,1000hrs
MSM 300 4.37 4.73 3.07 3.410.50 1.500.300.25 MSM 350
4.37
4.73
3.41
0.50 1.50
0.30
0.25
PPTC /M SM Ser ies
01 | spsemi
MSM020/60MSM075/16/24/33MSM110/16/24/33MSM150/16/24MSM200/12MSM260/13.2/16MSM010MSM014MSM030
REV.2014.05.01
Model Ihold Itrip Vmax Imax Pd max Current Time
Rmin Rmax (A)(A)(Vdc)(A)(w)(A)(S)
(Ω)(Ω)MSM0100.100.30
30
1000.80.5 1.50.75015.000MSM0140.14
0.34 60
1000.8 1.5
0.15
0.650 6.000MSM0200.200.4030
100
0.88.00.02
0.350 5.000MSM0300.300.60301000.88.00.10.250 3.000MSM050
0.50
1.00
15
100
巧克力工艺品
0.8
8.0
0.15
0.150
1.000
MSM050/240.50 1.00 241000.88.00.150.150 1.000
MSM075 0.75 1.50 13.2 1000.88.00.20.0900.450 MSM 110 1.10 2.20 8
1000.88.0
0.3
0.0500.2501.10 2.20 161000.88.00.30.0500.2501.50 3.00 8 1000.88.00.50.0400.1601.50 3.00 24100
0.88.00.50.0400.1601.60 2.80 8 1000.88.0 1.00.0300.1302.00 4.0081000.88.0 2.00.0200.1002.60 5.00 8 1000.88.0 2.50.0150.0503.00 5.00
81000.88.0 4.0 0.0120.0403.50 6.00 6 1000.88.0 4.0 0.0080.030
Ihold Itrip Vmax Imax Pd
Rmin/max R1max
*CAUTION
Model
—40℃
—20℃0℃25℃40℃50℃60℃70℃85℃MSM0100.1600.140.1200.100.0800.070.060.050.030MSM0140.230.190.170.140.1200.100.090.080.06MSM0200.290.260.230.200.1700.150.140.120.10MSM0300.440.390.350.300.2600.230.210.180.15MSM0500.590.570.550.500.4500.430.350.300.23MSM075
1.100.990.870.750.6300.570.490.450.35MSM110 1.60 1.45 1.28 1.100.9200.830.710.660.52MSM125 2.00 1.75 1.52 1.25 1.0000.950.900.750.53MSM150 2.30
2.05
1.50
toubai1.230
1.09
0.95
0.820.61MSM 160
2.10 1.96 1.88 1.60 1.260 1.12 0.98.
Maximum resistance of device at 25℃measured one hour after trippde tripping.Operation beyond the specified rating may result in damage and possible arcing.
Maximum operating volatge device can withstand without damage at ratde current(imax).Maximum fault current device can withstand without damage at rated voltage(Vmax).Typical power dissipatde from device when in the tripped state in 25℃still air.Minimum/Maximum device resistance prior to tripping at 25℃.
maximun ambient operating temperature(Tmao)vs.hold current(Ihold)
Trip current:Minimum current at which the device will always trip in 25℃still air
Maximum Time To Trip
Resistance Hold Current:Maximum current device will not trip in 25℃still air.
MSM050/30 0.50 1.00 30 100 0.8 8.0 0.15 0.150 1.000MSM110/16MSM125
MSM150MSM150/24 MSM160
MSM200
MSM260
MSM300MSM350MSM200 2.88 2.61 2.25 2.00 1.800 1.66 1.45 1.09 0.80
MSM260 3.90 3.42 2.96 2.60 2.330 2.07 1.94 1.35 1.00MSM 300 4.15 3.76 3.46 3.00 2.550 2.28 2.01 1.61 1.33MSM 350 4.84 4.39 4.04 3.50 2.980 2.66 2.35 1.88 1.55
0.84
0.63
PPTC /M SM Ser ies
02 | spsemi
0.20 0.40 60 1000.88.0 0.02 0.350 5.000
MSM020/600.75 1.50 161000.88.00.20.0900.450MSM075/160.75 1.50 241000.88.00.20.0900.450MSM075/24 1.10 2.20 33100
0.88.00.30.0900.450MSM075/33 1.10 2.20 241000.88.00.30.0500.250MSM110/24 1.10 2.20 33100
0.88.00.30.0500.250MSM110/33MSM200/12 1.50 3.00161000.88.00.50.0400.160MSM150/1662.00 4.00 12100
0.88.0 2.00.0200.1002.60 5.00 13.21000.88.0 2.50.0150.050MSM260/13.22.60 5.00 16 1000.8
8.0 2.5
0.015
0.050
MSM260/16REV.2014.05.01
Terminal pad materials Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability
Meets EIA specification RS186-9E and ANSI/J-STD-002Category 3.
Thermal Derating Curve
Typical Time-To-Trip At 25°C
Recommended Solder Reflow Conditions
Recommended reflow methods ：IR, vapor phase oven, hot air oven.Devices are not designed to be wave soldered to the bottom side Recommended maximum paste thickness is 0.25 mm (0.010 inch).Devices can be cleaned using standard method and solvents.：If reflow temperatures exceed the recommended profile,T e m p e r a t u r e (°C )
Average Time Current Curves
0.001
0.01
0.1
1
10100
0.1
1
10
100
T i m e I n S e c o n d s
0.10A
0.14A 0.20A 0.30A 0.50A 0.75A 1.10A 1.25A 1.50A 2.00A 2.50A 2.60A
Reel:
MSM010～350
1500pcs ／ｒｅｅｌ
PPTC /M SM Ser ies
03 | spsemi
REV.2014.05.01
豫公网安备41160202000603
站长QQ:729038198
关于我们
投诉建议