线路板流程术语中英文对照
流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油) －－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔 a. 开料( cut lamination)
a-1 裁板( sheets cutting)
功夫面
a-2 原物料发料(panel)(shear material to size)
b. 钻孔(drilling)
b-1 内钻(inner layer drilling )
b-2 一次孔(outer layer drilling )
b-3 二次孔(2nd drilling)
b-4 雷射钻孔(laser drilling )(laser ablation )
b-5 盲(埋)孔钻孔(blind & buried hole drilling)
c. 干膜制程( photo process(d/f))
c-1 前处理(pretreatment)
c-2 压膜(dry film lamination)
c-3 曝光(exposure)
c-4 显影(developing)
c-5 蚀铜(etching)
c-6 去膜(stripping)
c-7 初检( touch-up)
c-8 化学前处理,化学研磨( chemical milling )
c-9 选择性浸金压膜(selective gold dry film lamination)
c-10 显影(developing )
c-11 去膜(stripping )
制作无纺布手提袋developing , etching & stripping ( des )
d. 压合lamination
d-1 黑化(black oxide treatment)
d-2 微蚀(microetching)
d-3 铆钉组合(eyelet )
d-4 叠板(lay up)
d-5 压合(lamination)
d-6 后处理(post treatment)
d-7 黑氧化( black oxide removal )
d-8 铣靶(spot face)
d-9 去溢胶(resin flush removal)
e. 减铜(copper reduction)
e-1 薄化铜(copper reduction)
f. 电镀(horizontal electrolytic plating)
f-1 水平电镀(horizontal electro-plating) (panel plating)
f-2 锡铅电镀( tin-lead plating ) (pattern plating)
f-3 低于1 mil ( less than 1 mil thickness )
f-4 高于1 mil ( more than 1 mil thickness)
f-5 砂带研磨(belt sanding)
f-6 剥锡铅( tin-lead stripping)
f-7 微切片( microsection)
g. 塞孔(plug hole)
g-1 印刷( ink print )
g-2 预烤(precure)
g-3 表面刷磨(scrub)
g-4 后烘烤(postcure)
h. 防焊(绿漆/绿油): (solder mask)
h-1 c面印刷(printing top side)
h-2 s面印刷(printing bottom side)
皮诺敛酸
h-3 静电喷涂(spray coating)
h-4 前处理(pretreatment)
h-5 预烤(precure)
h-6 曝光(exposure)
h-7 显影(develop)
h-8 后烘烤(postcure)
h-9 uv烘烤(uv cure)
h-10 文字印刷( printing of legend )
h-11 喷砂( pumice)(wet blasting)
h-12 印可剥离防焊(peelable solder mask)
i . 镀金gold plating
i-1 金手指镀镍金( gold finger )
i-2 电镀软金(soft ni/au plating)
i-3 浸镍金( immersion ni/au) (electroless ni/au)
j. 喷锡(hot air solder leveling)
j-1 水平喷锡(horizontal hot air solder leveling)
j-2 垂直喷锡( vertical hot air solder leveling)
j-3 超级焊锡(super solder )
j-4. 印焊锡突点(solder bump)
k. 成型(profile)(form)
k-1 捞型(n/c routing ) (milling)
k-2 模具冲(punch)
k-3 板面清洗烘烤(cleaning & backing)
k-4 v型槽( v-cut)(v-scoring)
k-5 金手指斜边( beveling of g/f)
l. 开短路测试(electrical testing) (continuity & insulation testing)
l-1 aoi 光学检查( aoi inspection)
l-2 vrs 目检(verified & repaired)
l-3 泛用型治具测试(universal tester)
l-4 专用治具测试(dedicated tester)
l-5 飞针测试(flying probe)
m. 终检( final visual inspection)
m-1 压板翘( warpage remove)
m-2 x-out 印刷(x-out marking)
m-3 包装及出货(packing & shipping)
m-4 目检( visual inspection)
边缘融合处理器
m-5 清洗及烘烤( final clean & baking)
m-6 护铜剂(entek cu-106a)(osp)
m-7 离子残余量测试(ionic contamination test )(cleanliness test)
m-8 冷热冲击试验(thermal cycling testing)
桶盖m-9 焊锡性试验( solderability testing )
n. 雷射钻孔(laser ablation)
n-1 雷射钻tooling孔(laser ablation tooling hole)
n-2 雷射曝光对位孔(laser ablation registration hole)
n-3 雷射mask制作(laser mask)
n-4 雷射钻孔(laser ablation)
n-5 aoi 检查及vrs ( aoi inspection & verified & repaired)
n-6 blaser aoi (after desmear and microetching)
n-7 除胶渣(desmear)
n-8 微蚀(microetching )
pcb综合词汇中英文对照：
1、 印制电路：printed circuit网络收集
2、 印制线路：printed wiring
4、 印制板电路：printed circuit board (pcb)
5、 印制线路板：printed wiring board(pwb)
6、 印制元件：printed component
7、 印制接点：printed contact
8、 印制板装配：printed board assembly
9、 板：board
10、 单面印制板：single-sided printed board(ssb)
11、 双面印制板：double-sided printed board(dsb)
12、 多层印制板：mulitlayer printed board(mlb)
13、 多层印制电路板：mulitlayer printed circuit board
14、 多层印制线路板：mulitlayer prited wiring board
15、 刚性印制板：rigid printed board 16、 刚性单面印制板：rigid single-sided printed borad
17、 刚性双面印制板：rigid double-sided printed borad
18、 刚性多层印制板：rigid multilayer printed board
19、 挠性多层印制板：flexible multilayer printed board
20、 挠性印制板：flexible printed board
21、 挠性单面印制板：flexible single-sided printed board
22、 挠性双面印制板：flexible double-sided printed board
23、 挠性印制电路：flexible printed circuit (fpc)
24、 挠性印制线路：flexible printed wiring
25、 刚性印制板：flex-rigid printed board, rigid-flex printed board
26、 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、 齐平印制板：flush printed board
29、 金属芯印制板：metal core printed board
30、 金属基印制板：metal base printed board
31、 多重布线印制板：mulit-wiring printed board
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