pcb专业用语
一、综合词汇
2、印制线路：printed wiring
4、印制板电路：printed circuit board (pcb)
5、印制线路板：printed wiring board(pwb)
6、印制元件：printed component
7、印制接点：printed contact
8、印制板装配：printed board assembly
桥梁同步顶升9、板：board
10、单面印制板：single-sided printed board(ssb)
11、双面印制板：double-sided printed board(dsb)
12、多层印制板：mulitlayer printed board(mlb)
13、多层印制电路板：mulitlayer printed circuit board
14、多层印制线路板：mulitlayer prited wiring board
15、刚性印制板：rigid printed board
16、刚性单面印制板：rigid single-sided printed borad
17、刚性双面印制板：rigid double-sided printed borad
18、刚性多层印制板：rigid multilayer printed board
19、挠性多层印制板：flexible multilayer printed board 20、挠性印制板：flexible printed board
纳米润滑油
21、挠性单面印制板：flexible single-sided printed board
22、挠性双面印制板：flexible double-sided printed board
23、挠性印制电路：flexible printed circuit (fpc)
24、挠性印制线路：flexible printed wiring
25、刚性印制板：flex-rigid printed board, rigid-flex printed board
26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、齐平印制板：flush printed board
29、金属芯印制板：metal core printed board
30、金属基印制板：metal base printed board
31、多重布线印制板：mulit-wiring printed board
32、陶瓷印制板：ceramic substrate printed board
33、导电胶印制板：electroconductive paste printed board
34、模塑电路板：molded circuit board
35、模压印制板：stamped printed wiring board
36、顺序层压多层印制板：sequentially-laminated mulitlayer
37、散线印制板：discrete wiring board
38、微线印制板：micro wire board
39、积层印制板：buile-up printed board
微服务开发二、
三、
40、积层多层印制板：build-up mulitlayer printed board (bum)
41、积层挠印制板：build-up flexible printed board
42、外表层合电路板：surface laminar circuit (slc)
43、埋入凸块连印制板：b2it printed board
44、多层膜基板：multi-layered film substrate(mfs)
45、层间全内导通多层印制板：alivh multilayer printed board
46、载芯片板：chip on board (cob)
扬长机>原煤分级筛47、埋电阻板：buried resistance board
48、母板：mother board
49、子板：daughter board
50、背板：backplane
51、裸板：bare board
52、键盘板夹心板：copper-invar-copper board
53、动态挠性板：dynamic flex board
54、静态挠性板：static flex board
55、可断拼板：break-away planel
56、电缆：cable
57、挠性扁平电缆：flexible flat cable (ffc)
58、薄膜开关：membrane switch
59、混合电路：hybrid circuit
60、厚膜：thick film
61、厚膜电路：thick film circuit
62、薄膜：thin film
63、薄膜混合电路：thin film hybrid circuit
64、互连：interconnection
65、导线：conductor trace line
66、齐平导线：flush conductor
67、传输线：transmission line
68、跨交：crossover
69、板边插头：edge-board contact
70、增强板：stiffener
71、基底：substrate
72、基板面：real estate
73、导线面：conductor side
cslg
74、元件面：component side
75、焊接面：solder side
76、印制：printing
77、网格：grid
78、图形：pattern
79、导电图形：conductive pattern
80、非导电图形：non-conductive pattern
81、字符：legend
82、标志：mark
二、基材：
1、基材：base material
2、层压板：laminate
3、覆金属箔基材：metal-clad bade material
4、覆铜箔层压板：copper-clad laminate (ccl) 5、单面覆铜箔层压板：single-sided copper-clad laminate
6、双面覆铜箔层压板：double-sided copper-clad laminate
7、复合层压板：composite laminate
8、薄层压板：thin laminate
9、金属芯覆铜箔层压板：metal core copper-clad laminate
10、金属基覆铜层压板：metal base copper-clad laminate
11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
12、基体材料：basis material
13、预浸材料：prepreg
14、粘结片：bonding sheet
15、预浸粘结片：preimpregnated bonding sheer
16、环氧玻璃基板：epoxy glass substrate
17、加成法用层压板：laminate for additive process
18、预制内层覆箔板：mass lamination panel
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