DXP封装库中英文对照
序号
1
库名称
Axial
Lead
Diode
元件
英文
DIO6.35-3.1x1.6
DIO20.5-10x5.8
R-BGA8x11-B88
E-BIP-P4/D10
E-BIP-P4/X1.8
4 Bumpere集成块
d QFP -
Centre
Index
CAN - 2-12脚Circle pin 金属封arrangem装元件
ent
B-QFP-G100/T
图样 备注
引脚间距20.5mm,矩形长1mm,宽5.8mm
88脚球珊阵列封装IC
e Rectifier; 4 Terminals; Body 9.4 x
9.4 mm (typ); Pitch 5.08 mm
12
2 BGA - 集成块
Rectangle
Bridge
Rectifier
桥堆 3
Bridge Rectifier; 4 Terminals; Body
16.8 x 16.8 mm (typ); Pitch 10.67
mm
PQFP; 100 Leads; Body 19.1 x 19.1
mm; Pitch 0.635 mm四方扁平封装
5 CAN-2 Can; 2 Leads; Pin Circle Dia. 2.54
mm; Lead Dia. 0.48 mm (max)
3 Leads; Pin Circle Dia. 2.54 mm;
Lead Dia. 0.48 mm
8 Leads; Pin Circle Dia. 5.08 mm;
Lead Dia. 0.48 mm
CAN-3/D5.6
CAN-8/D9.2
6 Capacitor 电解电Electrolyt容封装
ic
Snap-In
Capacitor 无极性Non-Pola电容
r Axial
Capacitor
Non-Polar Dipped
Radial
CAPPRS10-22x20
CAPA17.8-13x21
CAPR2.54-5.1x2.5
CAPR5.08-5.1x2.5
CAPRD5-6.5x4.5
CAPNR2-5X11
Capacitor, Electrolytic, Radial,
Snap-In Pins; Body 22 x 20 mm
( typ); Pin Spacing 10 mm
(typ)
Capacitor, Ceramic, Thru-Hole, Axial
Leads; Body 13 x 21 mm (LxDia.
max) Pin Spacing 17.8 mm (typ)
Capacitor, Ceramic, Thru-Hole,
Dipped Radial; Body 5.1 x 2.5 mm
(WxT) Pin Spacing 2.54 mm (typ)
7
8
Capacitor, Ceramic, Thru-Hole,
Dipped Radial; Body 5.1 x 2.5 mm
(WxT) Pin Spacing 5.08 mm (typ)
Capacitor, Ceramic, Thru-Hole, Disc;
Body 6.5 x 4.5 mm (LxW max) Pin
Spacing 5 mm (typ)
9 Capacitor
Non-Polar Disc
Capacitor
Non-Pola
10
1
r Radial
11 Capacitor
Polar
Axial
Capacitor
Polar
Radial
Cylinder
Capacitor
Tantalum
Radial
Oval
CCGA -
Square
CAPNR5-5X11
CAPPA9.9-6.7X2.5
CAPPR5-8x5
CAPPR5-6.3x7
CAPNTO5.08-7.37x3.94
CAPNTO2.54-3.05x1.78A
CCGA35X35-B717
Capacitor, Axial, Polarised; Body 6.6
x 2.4 mm (LxDia. max), Lead Dia.
0.51 mm (typ)
Capacitor, Electrolytic, Radial; Body
8 x 5 mm ( typ); Pin Spacing 5
mm (typ)
Capacitor, Radial, Tantalum,
Non-Polarised; Body 7.37 x 3.94 x
6.86 mm (WxTxH max); Pin Spacing
5.08 mm (typ)
717-Pin Ceramic Column Grid Array
Package 1.27mm Pitch (CG717)
DFP; 6 Leads; Body 3.7 x 3.6 mm
(LxW max); Pitch 1.27 mm
DFP;64 Leads; Body 19.4 x 11.3 mm;
Pitch 0.5 mm
Quad Cerpak; 24 Leads; 10 x 10 mm;
Pitch 1.27mm
QFP; 68 Leads; Body 12.5 x 12.5
mm; Pitch 0.635mm
Chip Capacitor; Body 1.2 x 1.0 mm
(LxW typ)
Chip Capacitor; Body 3.81 x 2.54
mm (LxW typ)
12
13
12
14
15 Ceramic
DFP
CDFP-G6
CDFP-G8/X.6
CDFP-G64
16 Ceramic
QFP
(Square)
四方扁平封装IC(正方形)
CQFP-G24
CQFP-G68/X.4
CC1310-0504
17 Chip 贴片电Capacitor 容
- 2
Contacts
Chip 贴片二Diode - 2 极管
Contacts
Chip 贴片电Inductor - 感
2
Contacts
Chip 贴片电Resistor 2 阻
Contacts
Con 050 接口
DSubminiature
Con
12
CC3825-1510
CD3216-1206 18
12Chip Diode; Body 3.2 x 1.6 mm
(LxW typ)
Chip Diode; Body 1.2 x 1.0 mm
Chip Inductor; Body 1.6 x 0.8 mm
(LxW typ)
Chip Inductor; Body 2.1 x 1.5 mm
(LxW typ)
CD1310-0504
INDC1608-0603
INDC2115-0806
CR0603-0201
CR3216-1206
050DSUB1.27-2H28B
RCA/5.3-2H2
2
1219
12
12
20
Chip Resistor; Body 0.6 x 0.3 mm
(LxW typ)
Chip Resistor; Body 3.2 x 1.6 mm
Connector; D Subminiature 050
Series; 28 Position; Right Angle
21
Two Conductor Jack (RCA), Right 22 耳塞接
Audio 口 Angle, Thru-Hole, Body 10 x 12 x 13
mm (WxTxH)
JACK/6-V5
Connector; Jack Socket, 1/4"
[6.5mm], Thru-Hole, 5 Position,
Vertical, Body 15.7 x 15.7 x 31 mm
(WxTxH)
23 Con
CardEdge
CARD1.27-2V120
CARD/SM1.27-2V120
Connector; Card Edge .050 Series
PCI; 2x60 Position; 32-Bit Bus
Connector; Card Edge .050 Series
PCI; 2x60 Position; 32-Bit Bus
Connector; FH12 Series; 10 Position;
0.5mm Spaced Bottom Contact
24 Con
FPC-FFC
Con
Mains
Power
电源插座
FFC/SM0.5-2H10
IEC7-2H3
25 Mains Power Outlet, IEC60 320-2-2
F, PC Flange Rear Mount
Connector; PCB Jack, SMT; 1-Port, 8
Positions, 8 Loaded; Unshielded
without Lightpipes; Right Angle
26 Con Mod
Jack PCB
Con Rect
Stag PCB
Con RF
Coaxial
JACK/SM1.27-2H8H
SIMM1.27-3V80
MCX2.49-V5
MCX5.08-H5
27
28
Connector; SIMM II; 80 Position;
Vertical
Connector; RF Coaxial, MCX, SM; 5
Position; Vertical
Connector; RF Coaxial, MCX,
Thru-Hole; 5 Position; Right-Angle
Connector; USB1.1, Type A,
Thru-Hole; 4 Position; Right Angle
29 Con USB USB接口
USB2.0-4H4
USB/SM0.8-6H5
2SMX-3SMXB
BCY-W2/E4.7
BCY-W2/D3.1
BCY-W3/E5
USB2.0, Type B, SM; 5 Position;
Right Angle
Surface Mount Quartz Crystal; Body
6.2 x 3.7 mm
Thru-Hole; 2 Leads; 11.35 x 4.65 x
13.46 mm
Crystal, Thru-Hole; 2 Leads; Body
3.1 x 8.2 mm
Quartz Crystal, Thru-Hole; 3 Leads;
11.35 x 5 x 3.5
30 Crystal 晶振
Oscillator
31 Cylinder
with Flat
Index
BCY-W2/D4.8
BCY-W3
TO, Flat Index; 2 In-Line, Axial
Leads; Body Dia. 4.6mm; Lead Dia.
0.5 mm
TO, Flat Index; 3 In-Line, Axial
Leads; Body Dia. 4.8mm; Leads 0.61
x 0.61
3
BCY-W3/B.8 3 In-Line, Axial Leads; Body Dia.
4.6mm; Lead Dia. 0.5 mm
3 Axial Leads; Pin Circle Dia. 2.54
mm; Body Dia. 4.6mm; Lead Dia.
0.48
Oval Flange Mount with (2) Offset
Leads; Pin Spacing 10.93 mm; Lead
Dia. 1.09 mm
BCY-W3/R1.27
32 Diamond
BaseCAN
- 2 Leads
DIP - 七段数LED 码管
Display
MBFM-P2/P7.25
LEDDIP-10(14)
LEDDIP-10/X1.65
DIP-P14
S-DIP-8
33 LED, 7-Segment Display; 10 Pins;
Row Space 7.62 mm; Pitch 2.54 mm
10 Pins; Row Space 15.24 mm; Pitch
2.54 mm
DIP; 14 Round Pins; Row Space 7.62
mm; Pitch 2.54 mm
DIP; 8 Trim Leads; Row Spacing
7.62 mm; Pitch 2.54 mm
34
35
DIP - Peg 双列直Leads 插IC
DIP, 8-48脚Modified 双列贴-Trimmed 片IC
Leads
D-PAK
D-PAK/TO-252-AA; 3 Leads (1
Cropped); Body 10.2mm
3 Leads (1 Cropped); Body 10.1 x
6.6
D2-PAK; 7 Leads; Body 14.4 (inc.
leads) x 10.4 mm
DIP; 4 Leads; Row Spacing 7.62 mm;
Pitch 2.54 mm
40 Leads; 15.24 mm; Pitch 2.54 mm
DIP; 8 Leads; 7.62 mm; Pitch 2.54
mm
DIP; 8 Leads; 7.62 mm; Pitch 2.54
mm
Rectangular Flange Mount,
Thru-Hole; 3 Leads; Pitch 5.08 mm
36 SIP-G3/C7
SIP-G3/C7.4
SIP-G7/X.9
37 Dual-In-Line
Package
标准双DIP-4
列直插封装IC
DIP-40
DIP-8/D10.3
DIP-8/D9.8
38 Flange
Mount
with
Rectangular Base
R-SFM-T3/X3.4
39 FQFP- 四方扁Rectangle 平封装IC(长方形)
FQFP
(Square)
FR-QFP5X7-G32/N
FR-QFP28X40-G264/N
F-QFP5x5-G48/N
QFP; 32 Leads; 5 x 7 mm; Pitch 0.5
QFP; 264 Leads; Body 28 x 40 mm;
Pitch 0.5 mm。
(R-QFP14x20-G64/N,同类型QFP)
40 四方扁平封装QFP; 48 Leads; Body 5 x 5 mm;
Pitch 0.3 mm
4
-Corner
Index
41
IC(正方形长脚)
F-QFP20x20-G248/N
DFM-T5/H
DFM-T7/H
QFP; 248 Leads; Body 20 x 20 mm;
Pitch 0.3 mm引脚间距有0.3、0.4、0.5三种,此种是0.3
Horizonta卧式散l, Flange 热器安Mount 装
with Tab
TO, Thru-Hole, Horizontal, Heatsink
Mounted; 5 Bent Staggered Leads;
Pitch 1.7 mm
TO, Thru-Hole, Horizontal, Heatsink
Mounted; 7 Bent Staggered Leads;
Pitch 1.27 mm
PLCC; 18 Leads; Body 7.2 x 10.8
mm; Pitch 1.27 mm
Leaded Chip Carrier; 32 Leads; Body
11.4 x 14 mm
Leaded Chip Carrier; 20 Leads; Body
9 x 9 mm
42 Leaded 长方形ChipCarriPLCCer - 封装
Rectangle
Leadless
ChipCarrier-Square
MELF-
Diode
MELF-
Resistor
Miscellaneous
Connector PCB
正方形PLCC封装
贴片二极管
贴片电阻封装
通用连接器件封装库
R-QCC-J18
R-QCC-J32/Y2
QCC-J20/G6.1
MELF-D3512-1405
MELF-R2012-0805
BNC_RA
CON
HDR1X2
HDR1X2H
MHDR1X3
MHDR2X2
PIN2
SMB_V-RJ45
43
244
45
46
1
12Metal Electrode Face (MELF) Diode;
Body 3.5 x 1.5 mm
Metal Electrode Face (MELF)
Resistor; Body 2 x 1.4 mm
2.54×5.08mm,引脚间距2.54mm
2脚插座卧式安装
双排共4脚
复位开关
引脚间距400mil,100mil=2.54mm,所以0.4为2.54x4=10.16mm;
47 Miscellaneous
Devices
PCB
通用元器件封装库
AXIAL-0.4
0.3-1.0共8种
BAT-2
CAPR5-4X5
DIODE-0.4
DIP-12/SW
DIP_SW_8WAY_SMD
电源插座封装
磁介电容,间距5mm,圆直径4mm
引脚间距10.16mm二极管封装
双列直插IC
8个拨动开关
DPST-4
LED-0
LED-1
POT4MM-2
R2012-0805
RAD-0.1
放光二极管封装
光电二极管封装
0805贴片电阻封装
0.1-0.4四种,引脚间距从
5
RB7.6-15
SMD _LED
SPST-2
SW-7
TRANS
VR2
48 Miscellaneous
贴片电感/变压器
OPA1
100-400mil,200×100mil
变压器封装
VR2-VR5,电位器封装
SMT Inductor/Transformer; 4 Leads;
Body 8.89 x 8.89 x 4.19 mm;OPA1-OPA4四种,11.43 x 11.43 x
6.35
49 PinGrid
Array
Package
(PGA)
PGA26x26-P37
PGA40x40-P160
PGA; 37 Leads; Body 25.5 x 25.5
mm; Plain Grid
PGA; 160 Leads; Body 40 x 40 mm;
Plain Grid
50
51
QFP- 同第39、40项FQFP
Rectangle
Quad Flat 磁介电No Lead 容
Square
Resistor - 电阻封Axial 装
Shrink
Small
Outline
QFN3X3-12
QFN4X4-24
RES6.5-3.4X1.9
SSO-G8/P.65
SSO-G16/G3
Quad Flat No Lead; 12 Terminals;
Body 3 x 3 mm; Pitch 0.5 mm
52
53
Resistor, Axial; Body 3.4 x 1.9 mm
(LxDia. max), Lead Dia. 0.5 mm
Plastic SSOP; 8 Leads; Body Width
5.3 mm; Pitch 0.65
SSOP; 16 Leads; Body Width 3.9
mm; Pitch 0.635 mm
SIP with Mounting Hole; 3 Leads;
Body 11 x 7.6 x 2.5 mm (typ); Pitch
2.39 mm
54 Single 单列直In-Line 插封装
with
Mounting
Hole
Single 三极管
In-Line
桥堆
with no
Mounting
Hole
Small
Outline
6to20
Leads
同53
SFM-F3
55 SIP-P3/A5
SIP-P4/A6.8
SIP; 3 Leads; Body 20.3 x 15.6 x 5
mm (typ); Pitch 5.45 mm大功率三极管、场效应管、三端稳压集成
SIP; 4 Leads; Body 15 x 17.5 x 6.8
mm (typ); Pitch 5.1 mm
Small Outline (~0.8mm Pitch)
Small Outline; 8 Leads; Body Width
4.3 mm; Pitch 1.27 mm
SIP-P4/X1.7
SO-G34/Y2.2
56
57 各种类SOP8
型SOP
SMT LED; 2 C-Bend Leads; Body
3.5 x 2.8 x 1.9 mm, inc leads 。C-Bend Leads
58 Small 发光二Outline 极管
Diode - 2
DSO-C2/D5.6
DSO-F2/D6.2
DSO-F2/D4.4
6
59 SOT - 3 3个脚
Flat
Leads
SO-F3/P.4R
SO-F3/P.65R
SO-F3R
133SMT; 3 Flat Leads; Body 1.2 x 1.2 x
0.5 mm, inc leads
221Body 2.0 x 2.1 x 0.9 mm, inc leads
Body 1.6 x 1.6 x 0.6 mm, inc leads
SOT-353/SC-88A; 5 Leads; Body 2.1
x 2.4 mm, inc. leads;SOT-457/SC-74; 6 Leads; Body 3.1 x
2.6 mm, inc. leads
SOT-23; 3 Leads; Body 3.0 x 2.6
mm, inc. leads
60 SOT 23 - 5-6个5 and 6 脚
Leads
SOT 23 小功率贴片三极管
SO-G5/P.65
SO-G6/X.5
SO-G3
61
SOT89
DSO-G3
62
63
SOT 89
SOT 223
SOT-89;4.6 x 4.25 mm, inc. leads
SOT-223/SC-73; 4 Leads; Body 6.7 x
7.3 mm, inc. leads
大功率三极管、场效应管
64 Vertical,
Dual-Row, Flange
Mount
with Tab
加散热片双排竖装5-11脚
DFM-T5/A4.7V
DFM-T7/A4.8V
SFM-T3/132V
SFM-T3/A4.6V
CSM-7
ECX-3A
ECX-3M
ECX-3S
HC-49U
HC-49US
TO, Thru-Hole, Vertical, Heatsink
Mounted; 5 Bent Staggered Leads;
Pitch 1.7 mm
7 Bent Staggered Leads; Pitch 1.27
mm
TO, Thru-Hole, Vertical, Heatsink
Mounted; 3 In-Line Leads; Pitch 2.54
mm; Pin sequence 1, 3, 2;
TO, Thru-Hole, Vertical, Heatsink
Mounted; 3 In-Line Leads; Pitch 2.54
65 Vertical, 单排竖Single-Ro装2-12w, Flange 脚
Mount
with Tab
ECS 晶振封Crystal 装
Oscillator
66
不在Pcb库,在Library/Ecs/ ECS
Crystal Oscillator库,且将矩形修改为两端半径2.54的半圆形。
HC-49U:Quartz Crystal, Thru-Hole;
2 Leads; Body 5.08x2.54mm线宽0.2mm;Pitch 5.08mm
7
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