Chip level EMI shielding structure and manufacture

专利内容由知识产权出版社提供专利名称：Chip level EMI shielding structure andmanufacture method thereof发明人：Ming-Che Wu申请号：US13053528申请日：20110322公开号：US09287218B2公开日：20160315专利附图：摘要：A chip level EMI shielding structure and manufacture method thereof areprovided. The chip level EMI shielding structure includes a semiconductor substrate, atleast one ground conductor line, a ground layer, and a connection structure. The ground

conductor line is disposed on a first surface of the semiconductor substrate, and theground layer is disposed on a second surface of the semiconductor substrate. Theconnection structure is formed on a lateral wall of the semiconductor substrate forconnecting the ground conductor lines with the ground layer to form a shielding. Withsuch arrangement, the chip level EMI shielding structure can reduce the chip size and themanufacturing cost.申请人：Ming-Che Wu地址：Nantou County TW国籍：TW代理机构：Rosenberg, Klein & Lee