wafer_术语

硅片行业术语大全(中英文对照 I-Z)

Ingot - A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are

cut.

晶锭 - 由多晶或单晶形成的圆柱体，晶圆片由此切割而成。

Laser Light-Scattering Event - A signal pulse that locates surface imperfections on a wafer.

激光散射 - 由晶圆片表面缺陷引起的脉冲信号。

Lay - The main direction of surface texture on a wafer.

层 - 晶圆片表面结构的主要方向。

Light Point Defect (LPD) (Not preferred; see localized light-scatterer)

光点缺陷(LPD) （不推荐使用，参见“局部光散射”）

Lithography - The process used to transfer patterns onto wafers.

光刻 - 从掩膜到圆片转移的过程。

Localized Light-Scatterer - One feature on the surface of a wafer, such as a pit or a scratch that

scatters light. It is also called a light point defect.

局部光散射 - 晶圆片表面特征，例如小坑或擦伤导致光线散射，也称为光点缺陷。

Lot - Wafers of similar sizes and characteristics placed together in a shipment.

批次 - 具有相似尺寸和特性的晶圆片一并放置在一个载片器内。

Majority Carrier - A carrier, either a hole or an electron that is dominant in a specific region, such

as electrons in an N-Type area.

多数载流子 - 一种载流子，在半导体材料中起支配作用的空穴或电子，例如在N型中是电子。

Mechanical Test Wafer - A silicon wafer used for testing purposes.

机械测试晶圆片 - 用于测试的晶圆片。

Microroughness - Surface roughness with spacing between the impurities with a measurement of

less than 100 μm.

微粗糙 - 小于100微米的表面粗糙部分。

Miller Indices, of a Crystallographic Plane - A system that utilizes three numbers to identify plan

orientation in a crystal.

Miller索指数 - 三个整数，用于确定某个并行面。这些整数是来自相同系统的基本向量。

Minimal Conditions or Dimensions - The allowable conditions for determining whether or not a

wafer is considered acceptable.

最小条件或方向 - 确定晶圆片是否合格的允许条件。

Minority Carrier - A carrier, either a hole or an electron that is not dominant in a specific region,

such as electrons in a P-Type area.

少数载流子 - 在半导体材料中不起支配作用的移动电荷，在P型中是电子，在N型中是空穴。

Mound - A raised defect on the surface of a wafer measuring more than 0.25 mm.

堆垛 - 晶圆片表面超过0.25毫米的缺陷。

Notch - An indent on the edge of a wafer used for orientation purposes.

凹槽 - 晶圆片边缘上用于晶向定位的小凹槽。

Orange Peel - A roughened surface that is visible to the unaided eye.

桔皮 - 可以用肉眼看到的粗糙表面

Orthogonal Misorientation -

直角定向误差 -

Particle - A small piece of material found on a wafer that is not connected with it.

颗粒 - 晶圆片上的细小物质。

Particle Counting - Wafers that are used to test tools for particle contamination.

颗粒计算 - 用来测试晶圆片颗粒污染的测试工具。

Particulate Contamination - Particles found on the surface of a wafer. They appear as bright points

when a collineated light is shined on the wafer.

颗粒污染 - 晶圆片表面的颗粒。

Pit - A non-removable imperfection found on the surface of a wafer.

深坑 - 一种晶圆片表面无法消除的缺陷。

Point Defect - A crystal defect that is an impurity, such as a lattice vacancy or an interstitial atom.

点缺陷 - 不纯净的晶缺陷，例如格子空缺或原子空隙。

Preferential Etch -

优先蚀刻 -

Premium Wafer - A wafer that can be used for particle counting, measuring pattern resolution in

the photolithography process, and metal contamination monitoring. This wafer has very strict

specifications for a specific usage, but looser specifications than the prime wafer.

测试晶圆片 - 影印过程中用于颗粒计算、测量溶解度和检测金属污染的晶圆片。对于具体应用该晶圆片有严格的要求，但是要比主晶圆片要求宽松些。

Primary Orientation Flat - The longest flat found on the wafer.

主定位边 - 晶圆片上最长的定位边。

Process Test Wafer - A wafer that can be used for processes as well as area cleanliness.

加工测试晶圆片 - 用于区域清洁过程中的晶圆片。

Profilometer - A tool that is used for measuring surface topography.

表面形貌剂 - 一种用来测量晶圆片表面形貌的工具。

Resistivity (Electrical) - The amount of difficulty that charged carriers have in moving throughout

material.

电阻率（电学方面） - 材料反抗或对抗电荷在其中通过的一种物理特性。

Required - The minimum specifications needed by the customer when ordering wafers.

必需 - 订购晶圆片时客户必须达到的最小规格。

Roughness - The texture found on the surface of the wafer that is spaced very closely together.

粗糙度 - 晶圆片表面间隙很小的纹理。

Saw Marks - Surface irregularities

锯痕 - 表面不规则。

Scan Direction - In the flatness calculation, the direction of the subsites.

扫描方向 - 平整度测量中，局部平面的方向。

Scanner Site Flatness -

局部平整度扫描仪 -

Scratch - A mark that is found on the wafer surface.

擦伤 - 晶圆片表面的痕迹。

Secondary Flat - A flat that is smaller than the primary orientation flat. The position of this flat

determines what type the wafer is, and also the orientation of the wafer.

第二定位边 - 比主定位边小的定位边，它的位置决定了晶圆片的类型和晶向。

Shape -

形状 -

Site - An area on the front surface of the wafer that has sides parallel and perpendicular to the

primary orientation flat. (This area is rectangular in shape)

局部表面 - 晶圆片前面上平行或垂直于主定位边方向的区域。

Site Array - a neighboring set of sites

局部表面系列 - 一系列的相关局部表面。

Site Flatness -

局部平整 -

Slip - A defect pattern of small ridges found on the surface of the wafer.

划伤 - 晶圆片表面上的小皱造成的缺陷。

Smudge - A defect or contamination found on the wafer caused by fingerprints.

污迹 - 晶圆片上指纹造成的缺陷或污染。

Sori -

Striation - Defects or contaminations found in the shape of a helix.

条痕 - 螺纹上的缺陷或污染。

Subsite, of a Site - An area found within the site, also rectangular. The center of the subsite must

be located within the original site.

局部子表面 - 局部表面内的区域，也是矩形的。子站中心必须位于原始站点内部。

Surface Texture - Variations found on the real surface of the wafer that deviate from the reference

surface.

表面纹理 - 晶圆片实际面与参考面的差异情况。

Test Wafer - A silicon wafer that is used in manufacturing for monitoring and testing purposes.

测试晶圆片 - 用于生产中监测和测试的晶圆片。

Thickness of Top Silicon Film - The distance found between the face of the top silicon film and

the surface of the oxide layer.

顶部硅膜厚度 - 顶部硅层表面和氧化层表面间的距离。

Top Silicon Film - The layer of silicon on which semiconductor devices are placed. This is located

on top of the insulating layer.

顶部硅膜 - 生产半导体电路的硅层，位于绝缘层顶部。

Total Indicator Reading (TIR) - The smallest distance between planes on the surface of the wafer.

总计指示剂数(TIR) - 晶圆片表面位面间的最短距离。

Virgin Test Wafer - A wafer that has not been used in manufacturing or other processes.

原始测试晶圆片 - 还没有用于生产或其他流程中的晶圆片。

Void - The lack of any sort of bond (particularly a chemical bond) at the site of bonding.

无效 - 在应该绑定的地方没有绑定（特别是化学绑定）。

Waves - Curves and contours found on the surface of the wafer that can be seen by the naked eye.

波浪 - 晶圆片表面通过肉眼能发现的弯曲和曲线。

Waviness - Widely spaced imperfections on the surface of a wafer.

波纹 - 晶圆片表面经常出现的缺陷。

硅片行业术语大全(中英文对照 A-H)

Acceptor - An element, such as boron, indium, and gallium used to create a free hole in a

semiconductor. The acceptor atoms are required to have one less valence electron than the

semiconductor.

受主 - 一种用来在半导体中形成空穴的元素，比如硼、铟和镓。受主原子必须比半导体元素少一价电子

Alignment Precision - Displacement of patterns that occurs during the photolithography process.

套准精度 - 在光刻工艺中转移图形的精度。

Anisotropic - A process of etching that has very little or no undercutting

各向异性 - 在蚀刻过程中，只做少量或不做侧向凹刻。

Area Contamination - Any foreign particles or material that are found on the surface of a wafer.

This is viewed as discolored or smudged, and it is the result of stains, fingerprints, water spots, etc.

沾污区域 - 任何在晶圆片表面的外来粒子或物质。由沾污、手印和水滴产生的污染。

Azimuth, in Ellipsometry - The angle measured between the plane of incidence and the major axis

of the ellipse.

椭圆方位角 - 测量入射面和主晶轴之间的角度。

Backside - The bottom surface of a silicon wafer. (Note: This term is not preferred; instead, use

‘back surface’.)

背面 - 晶圆片的底部表面。（注：不推荐该术语，建议使用“背部表面”）

Base Silicon Layer - The silicon wafer that is located underneath the insulator layer, which

supports the silicon film on top of the wafer.

底部硅层 - 在绝缘层下部的晶圆片，是顶部硅层的基础。

Bipolar - Transistors that are able to use both holes and electrons as charge carriers.

双极晶体管 - 能够采用空穴和电子传导电荷的晶体管。

Bonded Wafers - Two silicon wafers that have been bonded together by silicon dioxide, which

acts as an insulating layer.

绑定晶圆片 - 两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。

Bonding Interface - The area where the bonding of two wafers occurs.

绑定面 - 两个晶圆片结合的接触区。

Buried Layer - A path of low resistance for a current moving in a device. Many of these dopants

are antimony and arsenic.

埋层 - 为了电路电流流动而形成的低电阻路径，搀杂剂是锑和砷。

Buried Oxide Layer (BOX) - The layer that insulates between the two wafers.

氧化埋层(BOX) - 在两个晶圆片间的绝缘层。

Carrier - Valence holes and conduction electrons that are capable of carrying a charge through a

solid surface in a silicon wafer.

载流子 - 晶圆片中用来传导电流的空穴或电子。

Chemical-Mechanical Polish (CMP) - A process of flattening and polishing wafers that utilizes

both chemical removal and mechanical buffing. It is used during the fabrication process.

化学-机械抛光(CMP) - 平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。

Chuck Mark - A mark found on either surface of a wafer, caused by either a robotic end effector, a

chuck, or a wand.

卡盘痕迹 - 在晶圆片任意表面发现的由机械手、卡盘或托盘造成的痕迹。

Cleavage Plane - A fracture plane that is preferred.

解理面 - 破裂面

Crack - A mark found on a wafer that is greater than 0.25 mm in length.

裂纹 - 长度大于0.25毫米的晶圆片表面微痕。

Crater - Visible under diffused illumination, a surface imperfection on a wafer that can be

distinguished individually.

微坑 - 在扩散照明下可见的，晶圆片表面可区分的缺陷。

Conductivity (electrical) - A measurement of how easily charge carriers can flow throughout a

material.

传导性（电学方面） - 一种关于载流子通过物质难易度的测量指标 。

Conductivity Type - The type of charge carriers in a wafer, such as “N-type” and “P-type”.

导电类型 - 晶圆片中载流子的类型，N型和P型。

Contaminant, Particulate (see light point defect)

污染微粒 （参见光点缺陷）

Contamination Area - An area that contains particles that can negatively affect the characteristics

of a silicon wafer.

沾污区域 - 部分晶圆片区域被颗粒沾污，造成不利特性影响。

Contamination Particulate - Particles found on the surface of a silicon wafer.

沾污颗粒 - 晶圆片表面上的颗粒。

Crystal Defect - Parts of the crystal that contain vacancies and dislocations that can have an

impact on a circuit’s electrical performance.

晶体缺陷 - 部分晶体包含的、会影响电路性能的空隙和层错。

Crystal Indices (see Miller indices)

晶体指数 （参见米勒指数）

Depletion Layer - A region on a wafer that contains an electrical field that sweeps out charge

carriers.

耗尽层 - 晶圆片上的电场区域，此区域排除载流子。

Dimple - A concave depression found on the surface of a wafer that is visible to the eye under the

correct lighting conditions.

表面起伏 - 在合适的光线下通过肉眼可以发现的晶圆片表面凹陷。

Donor - A contaminate that has donated extra “free” electrons, thus making a wafer “N-Type”.

施主 - 可提供“自由”电子的搀杂物，使晶圆片呈现为N型。

Dopant - An element that contributes an electron or a hole to the conduction process, thus altering

the conductivity. Dopants for silicon wafers are found in Groups III and V of the Periodic Table of

the Elements.

搀杂剂 - 可以为传导过程提供电子或空穴的元素，此元素可以改变传导特性。晶圆片搀杂

剂可以在元素周期表的III 和 V族元素中发现。

Doping - The process of the donation of an electron or hole to the conduction process by a dopant.

掺杂 - 把搀杂剂掺入半导体，通常通过扩散或离子注入工艺实现。

Edge Chip and Indent - An edge imperfection that is greater than 0.25 mm.

芯片边缘和缩进 - 晶片中不完整的边缘部分超过0.25毫米。

Edge Exclusion Area - The area located between the fixed quality area and the periphery of a

wafer. (This varies according to the dimensions of the wafer.)

边缘排除区域 - 位于质量保证区和晶圆片外围之间的区域。（根据晶圆片的尺寸不同而有所不同。）

Edge Exclusion, Nominal (EE) - The distance between the fixed quality area and the periphery of

a wafer.

名义上边缘排除(EE) - 质量保证区和晶圆片外围之间的距离。

Edge Profile - The edges of two bonded wafers that have been shaped either chemically or

mechanically.

边缘轮廓 - 通过化学或机械方法连接起来的两个晶圆片边缘。

Etch - A process of chemical reactions or physical removal to rid the wafer of excess materials.

蚀刻 - 通过化学反应或物理方法去除晶圆片的多余物质。

Fixed Quality Area (FQA) - The area that is most central on a wafer surface.

质量保证区(FQA) - 晶圆片表面中央的大部分。

Flat - A section of the perimeter of a wafer that has been removed for wafer orientation purposes.

平边 - 晶圆片圆周上的一个小平面，作为晶向定位的依据。

Flat Diameter - The measurement from the center of the flat through the center of the wafer to the

opposite edge of the wafer. (Perpendicular to the flat)

平口直径 - 由小平面的中心通过晶圆片中心到对面边缘的直线距离。

Four-Point Probe - Test equipment used to test resistivity of wafers.

四探针 - 测量半导体晶片表面电阻的设备。

Furnace and Thermal Processes - Equipment with a temperature gauge used for processing wafers.

A constant temperature is required for the process.

炉管和热处理 - 温度测量的工艺设备，具有恒定的处理温度。

Front Side - The top side of a silicon wafer. (This term is not preferred; use front surface instead.)

正面 - 晶圆片的顶部表面（此术语不推荐，建议使用“前部表面”）。

Goniometer - An instrument used in measuring angles.

角度计 - 用来测量角度的设备。

Gradient, Resistivity (not preferred; see resistivity variation)

电阻梯度 （不推荐使用，参见“电阻变化”）

Groove - A scratch that was not completely polished out.

凹槽 - 没有被完全清除的擦伤。

Hand Scribe Mark - A marking that is hand scratched onto the back surface of a wafer for

identification purposes.

手工印记 - 为区分不同的晶圆片而手工在背面做出的标记。

Haze - A mass concentration of surface imperfections, often giving a hazy appearance to the wafer.

雾度 - 晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。

Hole - Similar to a positive charge, this is caused by the absence of a valence electron.

空穴 - 和正电荷类似，是由缺少价电子引起的。